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Compound type photon sieve

A photon sieve and composite technology, applied in the direction of diffraction grating, etc., can solve the problems of difficult to obtain aperture and low diffraction efficiency, and achieve the effect of improving resolution and main spot energy

Inactive Publication Date: 2011-05-11
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional photonic sieve is still limited by the minimum processing line width, it is difficult to obtain a large aperture, and because only small holes transmit light, its diffraction efficiency is low, only about 10%

Method used

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  • Compound type photon sieve
  • Compound type photon sieve
  • Compound type photon sieve

Examples

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Embodiment Construction

[0009] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0010] This example figure 1 and figure 2 Contains transparent medium 1, metal layer 2 and microstructure 3, metal layer 2 is plated on transparent medium 1, and required microstructure 3 is etched on metal layer 2, along the radius of transparent medium 1 from inside to outside The direction of the transparent medium 1 is divided into different regions based on the minimum line width of the microfabrication, and the regions include the band region 4, the first region 5, and the second region 6 all have multiple sets of microstructures 3. Between the two groups of microstructures 3 in the first area 5, there is a wave zone 4, each group of microstructures 3 is composed of ring-shaped distributions with different radii a...

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Abstract

The invention discloses a compound type photon sieve which comprises a transparent medium, a metallic layer and a superfine structure, wherein the metallic layer is plated on the transparent medium; the required superfine structure is formed on the metallic layer in an etching manner; based on the smallest line width for superfine processing along the radius of the transparent medium from inner to outer, the transparent medium is divided into different areas which comprise a waveband area, a first area and a second area; the first area and the second area are both provided with a multiple groups of superfine structures; the waveband area is arranged between two groups of superfine structures in the first area; each superfine structure comprises a plurality of small holes which are different in radius and are distributed as annular strips with different radiuses; a ratio K of an aperture of the small hole arranged in each area to the width of the annular strip exists; the width of the outermost annular strip in the waveband area is equal to the smallest line width for superfine processing; and the radius of the innermost annular strip in the waveband area is 0.3 to 0.5 times of the that of the outermost annular strip.

Description

technical field [0001] The invention relates to the field of diffractive optical elements, in particular to a composite photon sieve. Background technique [0002] In the soft X-ray, extreme ultraviolet spectral region, conventional refractive or reflective optics are no longer effective. As a new type of diffractive element, photon sieve can focus and image in this spectral region, which has attracted widespread attention. In 2001, Professor Kipp from Germany proposed the concept of photon sieve for the first time in nature. The photon sieve is based on the zone plate, and uses a large number of small holes to replace the bright ring area on the zone plate. The ratio between the diameter of the photon sieve and the bandwidth of the corresponding zone plate is greater than 1. Compared with the traditional zone plate, the distribution of a large number of small holes on the photon sieve can effectively suppress the side lobe effect and high-order diffraction, and, because t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/18
Inventor 唐燕胡松赵立新严伟
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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