Preparation method for printed circuit board with insulating miniature radiators

Abstract

The invention relates to a preparation method for a printed circuit board (PCB) with insulating miniature radiators. The method is characterized in that on the basis of the traditional PCB preparation method, columnar insulating miniature radiators with high thermal conductivity are nested in the PCB, and a heating element(s) is (are) arranged on the bottom surface(s) of one or more insulating miniature radiators. In the invention, the insulating miniature radiators with high thermal conductivity are combined with a traditional rigid PCB, so that the rigid PCB has advantages of high thermal conductivity and stability of thermal transmission of the insulating miniature radiators, as well as the advantages of flexibility of wiring, reliability of electrical connection of traditional PCBs; therefore, heat radiated by light emitting diodes and other heating elements during operation can be transmitted outside the PCB promptly and effectively; and the PCB with the insulating miniature radiators serve as an ideal carrying board for heating elements and arrays thereof. The preparation method is simple and convenient, and easy in implementation and strong in practicability.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a novel method for preparing a printed circuit board which combines an insulating micro-radiator with a traditional printed circuit board. Background technique [0002] Printed Circuit Board (PCB) is one of the important components of the electronics industry. PCB can provide fixed and assembled mechanical support for electronic components, and can realize electrical connection between electronic components. In addition, the component numbers and some graphics are printed on the PCB, which provides convenience for component insertion, inspection and maintenance. Almost every kind of electronic equipment, ranging from electronic watches and calculators to large computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed circuit boards are used for the electrical interc...

AI Technical Summary

Problems solved by technology

[0003]The traditional printed circuit board adopts hole metallization structure, the insulating material between layers is FR4 material, its thermal conductivity is 0.4W / mk, and the transmission Low thermal capacity; metal-based circuit boards developed in recent years, the thermal conductivity of insulating materials between layers is 1.3-2.2W / mk, and the heat transfer capacity is still limited

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