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Right claw of bonder

A bonding machine and push claw technology, applied in conveyor objects, electrical components, electric solid devices, etc., can solve problems such as affecting the application ability of equipment, hidden dangers of product quality, and difficulty, so as to reduce the consumption of spare parts and the reduction of gold wires. Deformation and neck wire breakage, the effect of reducing difficulty

Active Publication Date: 2011-05-18
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in reality, it is often difficult for these factors to fully meet the requirements in the modification of equipment types, especially in terms of the height and strength of the claw closure point, which is the cause of gold wire deformation and neck broken wires caused by equipment travel. A very important factor, which affects the actual application capability of the equipment, and also creates hidden dangers and risks to the quality of the product

Method used

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  • Right claw of bonder
  • Right claw of bonder
  • Right claw of bonder

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Experimental program
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Embodiment approach

[0021] Such as figure 1 with figure 2 An embodiment of the right claw of the bonding machine of the present invention is shown. The right claw of the bonding machine includes a claw device, a transfer movable frame 4 and a push claw device, and the transfer movable frame 4 is placed on the hook device. Connect movable frame 4 to link to each other with pushing claw device. The claw device is composed of a bottom plate 1, a vertical plate 2 and a first hook plate 3. There is a gap on the left side of the front part of the bottom plate 1. The vertical plate 2 is placed on the rear upper surface of the bottom plate 1. The right front of the bottom plate 1 is connected to There is a first hook board 3 . A lateral notch 5 is provided in the middle of one side of the transfer movable frame 4 , and the transfer movable frame 4 is fixed on the bottom plate 1 by screws. The push claw device consists of a connecting block 6, a bump 7 and a second hook plate 8, the connecting block ...

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PUM

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Abstract

The invention discloses a right claw of a bonder and in particular discloses a right claw structure for controlling tape transport of frames. The right claw comprises a claw hooking device, a transfer movable frame and a claw pushing device, wherein the transfer movable frame is arranged on the claw hooking device and is connected with the claw pushing device. The right claw has the advantages of effectively reducing gold wire deformation and neck wire breaking caused by tape transport of the equipment, elevating the yield, reducing the quality risk, greatly reducing the difficulty and time of equipment adjustment and maintenance, improving the use efficiency of the equipment, reducing the consumption of spare parts of the equipment and lowering the maintenance cost of the spare parts of the equipment.

Description

technical field [0001] The invention relates to a workbench part of a bonding device, in particular to a right claw structure for controlling the frame transport of these models. Background technique [0002] At present, in the bonding process of semiconductor packaging, when fully automatic equipment is used, because the products that have been soldered with gold wires are transferred to the right outlet through the entire workbench, the requirements for the entire transfer process are very high. Existing In the structure of the equipment, a solenoid valve is used to control the opening and closing of the claws, and a Hall sensor is used to control the strength of the claws. Finally, the requirements are guaranteed through a series of installation and calibration methods. In other words, a good belt feeding process requires the parallelism of the track, the height of the front support rail, the height of the closing point of the claw, the strength of the claw closing, and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/67H01L21/677
CPCH01L24/78H01L2224/78H01L2924/00014H01L2224/48H01L2924/00012
Inventor 陈建兴张岳平陈建斌张建华
Owner NANTONG FUJITSU MICROELECTRONICS