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Polyamic acid resin composite and polyimide film and laminated material prepared from same

A technology of polyamic acid resin and composition, which is applied in the field of polyamic acid resin composition and polyimide film prepared therefrom, and can solve the problems of film embrittlement, film shrinkage, difficult control of reproducibility, etc.

Inactive Publication Date: 2011-06-08
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can reduce the thermal expansion coefficient of polyimide film and maintain the transparency of film simultaneously, its reproducibility is difficult to control, and easily produces film shrinkage phenomenon, especially when high content is added (when adding amount is greater than 20wt%) more It is easy to occur and even cause embrittlement of the film

Method used

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  • Polyamic acid resin composite and polyimide film and laminated material prepared from same
  • Polyamic acid resin composite and polyimide film and laminated material prepared from same
  • Polyamic acid resin composite and polyimide film and laminated material prepared from same

Examples

Experimental program
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Effect test

Synthetic example 1

[0039] Synthesis example 1, have the preparation of the nanoscale silicon dioxide DMAc solution that contains hydroxyl group (-OH) through the surface of modification

[0040] 100g solid content of 20% has the isopropanol sol (Jingming Chemical Industry) of nano-scale silicon dioxide containing hydroxyl (-OH) on the surface, 1g N-phenyl-3-aminopropyltrimethoxysilane modifier and Add 80g of N,N-dimethylacetamide (DMAc) into a 500ml reaction bottle, react at 40°C for 6 hours, use vacuum distillation to distill 80g of isopropanol and a small amount of water, and replace it with DMAc solution , to obtain a nano-scale silica DMAc solution (DMAc-sol) with a modified surface containing hydroxyl (-OH) with a solid content of 20%, and the average particle diameter of its silica through dynamic light scattering particle size analysis 20nm.

Synthetic example 2

[0042] The isopropanol sol (Jingming Chemical Industry) with the nano-scale silicon dioxide of surface containing hydroxyl (-OH) of 100g solid content 20%, 1g 3-aminopropyltrimethoxysilane modifier and 80g of N, N - Dimethylacetamide (DMAc) was added to a 500ml reaction bottle, and after reacting at 25°C for 6 hours, 80g of isopropanol and a small amount of water were distilled off by vacuum distillation, and replaced with DMAc solution to obtain a solid content of 20 % of nano-scale silicon dioxide DMAc solution (DMAc-sol) with modified surface containing hydroxyl group (-OH), the average particle size of silicon dioxide is 40nm through dynamic light scattering particle size analysis.

Synthetic example 3

[0044] With the isopropanol sol (Jingming chemical industry) of the nano-scale silicon dioxide that has surface containing hydroxyl (-OH) of 100g solid content 20%, 1g 3-propyl isocyanate trimethoxysilane modifier and 80g N, N- Add dimethylacetamide (DMAc) into a 500ml reaction bottle, react at 25°C for 6 hours, use vacuum distillation to distill 80g of isopropanol and a small amount of water, and replace it with DMAc solution to obtain a solid content of 20%. The nano-scale silica DMAc solution (DMAc-sol) with modified surface containing hydroxyl group (-OH) on the surface (DMAc-sol for short), the average particle diameter of silica is 60nm as a result of dynamic light scattering particle size analysis.

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Abstract

The invention provides a polyamic acid resin composite and a polyimide film and laminated material prepared from same. The polyamic acid resin composite contains polyamic acid resin, solvent and polar non-proton solution of nanometer silicon dioxide which is modified with surface modifier and contains -OH on the surface, wherein the structure of the surface modifier is shown in the formula (I), namely R1-Si-(OR2)3; and R1 represents aliphatic group or aromatic group and R2 represents C1-8 alkyl.

Description

【Technical field】 [0001] The present invention relates to a polyamic acid resin composition and a polyimide film prepared therefrom, in particular to a polyamic acid resin with high transparency, high modulus (modulus), high dimensional stability and low moisture absorption Composition and polyimide film prepared therefrom. 【Background technique】 [0002] With the rapid development of network communication and consumer electronics products, under the emphasis on high-performance, high-speed transmission and light weight and thinness, the required flexible substrate materials are also developing towards higher precision, high density and multi-function. In addition to thin copper In addition to the trend of globalization and high-density micro-circuit processing, in response to the needs of high-speed transmission and high-reliability product construction, the requirements for material properties are becoming increasingly stringent. The mainstream needs of flexible board mate...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K9/06C08K3/36
Inventor 吕常兴吕奇明金进兴李宗铭
Owner IND TECH RES INST
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