Low-silver lead-free solder alloy

A lead-free solder alloy and solder alloy technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of high alloy cost, copper dissolution to copper content increase, etc., to achieve cost reduction and extended use. effect of life

Inactive Publication Date: 2011-06-29
YIK SHING TAT INDUSTRIALCO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It solves the problem of the high cost of the existing Sn-(3.0~4.0)Ag-(0.5~0.7)Cu series solder alloys, and at the same time solves the problem that the copper dissolves until the copper content rises in wave soldering. Save raw material cost and prolong the service life of solder

Method used

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  • Low-silver lead-free solder alloy
  • Low-silver lead-free solder alloy
  • Low-silver lead-free solder alloy

Examples

Experimental program
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Effect test

Embodiment 1

[0026] The lead-free solder alloy composition and element weight percentage are as follows: Ag: 0.01wt%, Cu: 3.0wt%, Ni: 0.1wt%, P: 0.1wt%, Ga: 0.02%, Sn is the balance.

Embodiment 2

[0028] The weight percentages of the lead-free solder alloy elements are as follows: Ag: 0.5wt%, Cu: 0.7wt%, Ni: 0.02wt%, P: 0.02wt%, and Sn is the balance.

Embodiment 3

[0030] The composition of lead-free solder alloy elements in weight percent is as follows: Ag: 1.0wt%, Cu: 0.1wt%, Ni: 0.001wt%, P: 0.001wt%, Ga: 0.08%, and Sn is the balance.

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Abstract

The invention discloses a low-silver lead-free solder alloy. The alloy comprises the following chemical components in percentage by weight: 0.01 to 1.0 percent of Ag, 0.1 to 3.0 percent of Cu, 0.001 to 0.1 percent of Ni, 0.001 to 0.1 percent of P and the balance of Sn, wherein the Ni content is further optimized to be 0.005 to 0.08 weight percent, and the P content is further optimized to be 0.005 to 0.08 percent; and a Ga element can be further added. Compared with the ordinary lead-free Sn3.0Ag0.5Cu alloy, the solder alloy has the characteristics that: the cost of raw materials is reduced due to low used silver content; and since the elements such as Ni, P and the like are added and the content of the elements are optimized, the dissolution of a copper element of a bonding pad of a component in the wave soldering process in a tin furnace can be effectively reduced, the frequency of replacing solder in the tin furnace is lower, the service life of the solder is prolonged, and the using cost is saved for a production line.

Description

technical field [0001] The invention relates to a lead-free solder alloy, in particular to a low-silver lead-free solder alloy for wave soldering. Background technique [0002] After the electronic assembly industry realizes the lead-free process conversion, the lead-free solder alloy commonly used in the wave soldering process has changed from the traditional Sn-37Pb to the binary alloy composed of Sn-Cu and the ternary alloy composed of Sn-Ag-Cu. alloy. [0003] The transformation of the lead-free process has brought new problems to the electronic process technology: [0004] The first problem is that the increase of process temperature will test the heat-resistant parts in assembly. [0005] The traditional Sn-37Pb is a eutectic alloy with a melting point of 183°C, while Sn0.7Cu is a Sn-Cu eutectic alloy with a melting point of 227°C. The main solder alloys based on Sn-Ag-Cu are Sn3.8Ag0. 7Cu, Sn3.0Ag0.5Cu, Sn1.0Ag0.5Cu, Sn0.3Ag0.7Cu, the melting point is 217~227℃, for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 徐金华马鑫吴建雄吴家家
Owner YIK SHING TAT INDUSTRIALCO LTD
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