Polyamide based resin composition having excellent whiteness, thermal conductivity, and extruding moldability, and preparation method and product thereof

A technology of polyamide resin and thermoplastic resin, applied in the field of polyamide-based resin composition and preparation and products with excellent whiteness, thermal conductivity and extrusion formability

Inactive Publication Date: 2011-07-06
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there has been no attempt to radiate heat by improving the thermal conductivity of the reflector itself.

Method used

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  • Polyamide based resin composition having excellent whiteness, thermal conductivity, and extruding moldability, and preparation method and product thereof
  • Polyamide based resin composition having excellent whiteness, thermal conductivity, and extruding moldability, and preparation method and product thereof
  • Polyamide based resin composition having excellent whiteness, thermal conductivity, and extruding moldability, and preparation method and product thereof

Examples

Experimental program
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Effect test

Embodiment

[0075] Example

[0076] The compounds used in Examples and Comparative Examples are as follows.

[0077] (A) polyamide resin

[0078] A polyamide resin containing 100 parts by weight of dicarboxylic acid and 100 parts by weight of 1,6-diaminohexane consisting of 60 wt% of terephthalic acid and 40 wt% of adipic acid was used.

[0079] (B) Boron nitride is used for thermal conductivity and whiteness.

[0080] (C) Using glass fiber as a filler.

[0081] (D) Polymethyl methacrylate having a weight average molecular weight of 1,250,000 is used as a thermoplastic resin having compatibility with polyamide and a weight average molecular weight of 500,000 to 5,000,000.

[0082] (E) Titanium dioxide is used as a white pigment.

[0083] Each polyamide thermoplastic resin (Examples 1-6, Comparative Examples 1-6) was prepared by mixing each compound according to the mixing ratio in Table 1 below, thermal conductivity was measured according to ASTM E 1530, and whiteness was also measure...

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Abstract

The present invention provides a polyamide resin composition having whiteness, thermal conductivity and extrusion molding property, which includes (A) polyamide resin; (B) heat conductive filler; (C) filler; and (D) thermoplastic resin which has miscibility with the polyamide and weight average molecular weight of 500,000 to 5,000,000. The above polyamide resin composition includes about 10 to about 80 % by weight of the (A) polyamide resin, about 5 to about 55 % by weight of the (B) heat conductive filler, about 5 to about 30 % by weight of the (C) filler, and about 5 to about 80 % by weight of the (D) thermoplastic resin which has miscibility with the polyamide and weight average molecular weight of 500,000 to 5,000,000. The present invention provides a method for preparing the polyamide resin composition. The invention also provides a product prepared from the polyamide resin composition.

Description

[0001] References to related applications [0002] This application claims priority to Korean Patent Application No. 2009-0136120 filed with the Korean Intellectual Property Office on December 31, 2009, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The present invention relates to a polyamide resin composition and a method for producing a polyamide resin composition having excellent whiteness, thermal conductivity, and extruding moldability. More specifically, the present invention relates to a polyamide resin composition and preparation of a thermoplastic resin having a weight average molecular weight of 500,000 to 5,000,000 due to simultaneous use of a thermally conductive filler and miscibility with polyamide, which has excellent whiteness, thermal conductivity, and extrudability. Method for moldable polyamide resin composition. The present invention also relates to an article made of the above polyamide resin composi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00C08L33/00C08L23/00C08L77/06C08L33/12C08K13/04C08K7/14C08K3/38C08K3/22
CPCC08K3/0033C08L23/00C08L77/06C08L33/12C08K3/38C08L77/00C08L81/04C08K3/013C08L2666/06C08L81/00C08L2666/04C08J5/00
Inventor 南宫韩申赞均柳聆湜尹凡奭金钟连林钟喆
Owner CHEIL IND INC
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