Flexible transparent electronic circuit and preparation method thereof

An electronic circuit, transparent technology, applied in printed circuit components, conductive pattern formation, metal pattern materials, etc., can solve the problems of low contact probability, increase the production cost of enterprises, and decrease the conductivity, and achieve strong bending resistance, Realize the effect of stealth and good conductivity

Inactive Publication Date: 2011-07-06
CHINA JILIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the low contact probability between nano-silver particles and a large space left, if it is occupied by a large amount of non-conductive resin, it will form a barrier to the conductive particles and reduce the overall conductivity; and there may be The phenomenon of uneven dispersion of nano-silver paste can easily cause the gap between spherical nano-silver particles in the paste to be too large or agglomerate, resulting in a decrease in conductivity or even an open circuit
Therefore, in the production process, the above problems are often explained by adding high-concentration nanoparticles, but increasing the amount of spherical nano-silver particles will greatly increase the production cost of the enterprise, and the price of printed circuit boards will remain high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Silver nitrate, ethylene glycol and polyvinylpyrrolidone are used as main raw materials, and the mass ratio of silver nitrate, ethylene glycol and polyvinylpyrrolidone is 1:60:4, and an appropriate amount of sodium chloride is specially added, and reacted at 155°C for 45 minutes to obtain nano silver thread. The nano-silver wire conductive silver paste is formulated with nano-silver wire, polyethylene glycol, epoxy resin and tetrahydrofuran as main raw materials, wherein the content of nano-silver wire is 40%. The conductive silver paste of nano-silver wires was printed on the transparent flexible circuit substrate to form a predetermined electronic circuit with a circuit thickness of 0.1mm, and was cured at 100°C for 2 hours under the irradiation of an infrared lamp.

[0013] The measured circuit transparency is 98%, and the circuit body resistivity measured by the four-electrode test method is 1.5×10 -4 Ω·cm, no cracks will appear in the circuit after 100 times of re...

Embodiment 2

[0015] Silver nitrate, ethylene glycol and polyvinylpyrrolidone are used as main raw materials, and the mass ratio of silver nitrate, ethylene glycol and polyvinylpyrrolidone is 1:60:4, and an appropriate amount of sodium chloride is specially added, and reacted at 155°C for 45 minutes to obtain nano silver thread. The nano silver wire conductive silver paste is formulated with nano silver wire, polyethylene glycol, epoxy resin and tetrahydrofuran as main raw materials, wherein the content of nano silver wire is 50%. Print the conductive silver paste of the nano-silver wire on the transparent flexible circuit substrate to form a set electronic circuit, the circuit thickness is 0.08mm, and it is cured at 100°C for 2 hours under the irradiation of an infrared lamp.

[0016] The measured circuit transparency is 92%, and the circuit body resistivity measured by the four-electrode test method is 1.0×10 -4 Ω·cm, no cracks will appear in the circuit after 150 times of repeated bendi...

Embodiment 3

[0018] Silver nitrate, ethylene glycol and polyvinylpyrrolidone are used as main raw materials, and the mass ratio of silver nitrate, ethylene glycol and polyvinylpyrrolidone is 1:60:4, and an appropriate amount of sodium chloride is specially added, and reacted at 155°C for 45 minutes to obtain nano silver thread. The nano-silver wire conductive silver paste is formulated with nano-silver wire, polyethylene glycol, epoxy resin and tetrahydrofuran as main raw materials, wherein the content of the nano-silver wire is 60%. Print the nano-silver wire conductive silver paste on the transparent flexible circuit substrate to form a set electronic circuit, the circuit thickness is 0.05mm, and it is cured at 100°C for 2 hours under the irradiation of an infrared lamp.

[0019] The measured circuit transparency is 85%, and the circuit body resistivity measured by the four-electrode test method is 0.8×10 -4 Ω·cm, no cracks will appear in the circuit after 150 times of repeated bending ...

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Abstract

The invention discloses a preparation method for a flexible transparent electronic circuit, which enables a circuit to be printed on a flexible circuit board and keeps the flexibility and transparency of the circuit. The method comprises the following steps: nanometer silver wires with diameter of 30 nm and with length-diameter ratio greater than 200 are prepared by a chemical reduction method, then the nanometer silver wires, epoxy resin and polyethylene glycol are mixed according to a certain proportion for preparing conductive silver paste, and then a circuit with thickness of 0.1 mm is printed on a flexible circuit board with the conductive silver paste by using the screen printing technology. The electronic circuit prepared by the method has the characteristics of high bending resistance, high electric conductivity, transparency and the like, and is a key component for a novel flexible transparent electronic device.

Description

technical field [0001] The invention relates to an electronic circuit technology, in particular to a bendable transparent flexible circuit and a preparation method thereof. Background technique [0002] With the maturity of flexible circuit board technology and the continuous increase in the use of new electronic products in the future, the reliability of the circuit conduction of flexible circuit boards is even more important. Flexible electronic devices are often accompanied by circuit board deformation during use, especially circuit channels will be subjected to various tensile, compressive and bending deformations. During the deformation process, the reliability and stability of the electrical conductivity of the circuit channel is the prerequisite for the normal operation of flexible electronic devices. [0003] In the existing electronics industry, the microelectronic package connection is mainly realized through Pb / Sn solder and conductive silver paste, and the condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/12
Inventor 刘嘉斌刘波蒋玲波陈设梁君张金燕秦海英
Owner CHINA JILIANG UNIV
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