Method for preparing magnesium alloy plate strip with grain size in symmetric gradient distribution along plate thickness direction
A technology of magnesium alloy plate and grain size, which is applied in the field of magnesium alloy processing, can solve the problems of poor ductility and achieve the effects of improving strength and ductility, simple operation, and weakening texture
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0027] The AZ31 magnesium alloy was subjected to two-way repeated bending deformation with 3 rolls at 150°C, and the deformation amount in a single pass was 0.25. The size and texture strength are distributed in a gradient along the plate thickness direction, the surface grains are refined to 1 / 3 of the original, and the thickness of the fine-grained layer is about 0.4mm; the {0001} basal texture strength of the surface layer is weakened to only the middle About 1 / 4 of the layer.
Embodiment 2
[0029] The AZ31 magnesium alloy was subjected to two-way repeated bending deformation with 3 rolls at 250 °C, and the deformation amount in a single pass was 0.14. The size and texture strength also have a gradient distribution along the plate thickness direction, the surface grains are refined to 1 / 3 of the original, and the thickness of the fine-grained layer is about 0.3mm; the {0001} basal plane texture strength of the surface layer is only middle About 1 / 4 of the layer.
Embodiment 3
[0031] The AZ31 magnesium alloy was subjected to two-way repeated bending deformation with 4 rolls at room temperature. The deformation amount in a single pass was about 0.01. After 3 passes of deformation, it was recrystallized and annealed at 400°C for 10 minutes. Microstructure observation and texture analysis showed that the surface grains The size has grown substantially to more than 5 times its original size.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com