Alloy-type bonding wire with composite plating on surface

Abstract

The invention relates to an alloy-type bonding wire with a composite plating on the surface, which comprises a silver alloy core material and a plating on the surface of the silver alloy core material, wherein the silver alloy core material mainly comprises silver. The invention is characterized in that trace metals for improving ductility are added to the silver alloy core material mainly comprising silver; the silver alloy core material is subjected to monocrystal melting stretching to obtain a silver alloy rod; the silver alloy rod is subjected to crude stretching, intermediate stretching and surface cleaning to obtain a silver alloy core wire; composite electroplating is carried out on the surface of the silver alloy core wire; and the silver alloy core wire is subjected to ultrafine stretching to obtain the alloy-type bonding wire with a composite plating on the surface. The alloy-type bonding wire can have favorable final plastic deformation capability without intermediate annealing in the subsequent ultrafine stretching process; the elongation percentage of the alloy-type bonding wire is at least 12% after the alloy-type bonding wire is subjected to dynamic on-line annealing under inert gas protection; the properties of the alloy-type bonding wire are similar to those of the bonding alloy wire; and only high-purity nitrogen is needed for ball burning protection in the packaging and bonding process. When the alloy-type bonding wire is used for packaging instead of a bonding metal wire, the device has stable reliability, which does not have obvious difference as compared with the bonding metal wire. The cost of the product can be controlled at about 15 yuan/hectometer, and thus, the invention has the advantage of high cost performance.

Description

technical field [0001] The invention relates to a bonding wire, in particular to an alloy type bonding wire with a composite coating on the surface. Background technique [0002] Commonly used bonding gold wire diameter is Φ16~38μm. Its production method is to add a certain amount of trace elements to high-purity gold, and then smelt and cast it into a rod-multiple stretching-dynamic online annealing-coiling and other processes. As the international gold price continues to increase, the price of bonding gold wires made of gold also continues to increase, which in turn greatly increases the cost of LED packaging. It is necessary to research and develop alloy-type bonding wires that replace bonding gold wires. Contents of the invention [0003] The technical problem to be solved by the present invention is to make up for the defects of the above-mentioned prior art, and to provide an alloy-type bonding wire with a composite coating on the surface. [0004] The technical pr...

AI Technical Summary

Problems solved by technology

Due to the continuous increase of the international gold price, the price of bonding gold wire made of gold is also continuously increasing, whic