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Substrate for probe card

A probe card and substrate technology, applied in the field of probe cards, can solve the problems of signal branch deviation, impedance mismatch, unsuitability for detection equipment, etc., and achieve the effect of reducing signal deviation and impedance mismatch.

Inactive Publication Date: 2011-07-27
UNIMEMS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will cause branch deviation of the signal and cause impedance mismatching (Impedance Mismatching)
Therefore, there is a problem that it is not suitable as a testing device for semiconductor elements that are gradually developing to high-frequency (High Frequency) and high-speed (High Speed) characteristics.

Method used

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  • Substrate for probe card
  • Substrate for probe card
  • Substrate for probe card

Examples

Experimental program
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Embodiment Construction

[0026] Hereinafter, in order to understand the present invention more specifically, preferred embodiments will be described with reference to the accompanying drawings.

[0027] figure 2 is a side view of a probe card for explaining the present invention, Figure 3a , Figure 3b is a plan view of a probe card substrate according to an embodiment of the present invention, Figure 4a is an enlarged view of a probe card substrate according to an embodiment of the present invention, Figure 4b It is a schematic diagram for explaining the path of the electrical signal of the probe card according to the embodiment of the present invention.

[0028] refer to Figure 2 to Figure 4b , the probe card 200 used to illustrate the present invention includes a printed circuit board 210 , test probes 120 , a probe card substrate 100 , a device under test 140 , and probe pins 130 .

[0029] The printed circuit board 210 is formed with a circuit pattern for transmitting electrical signals...

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PUM

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Abstract

The invention relates to a substrate for a probe card and provides a substrate for a probe card which is characterized in that electrical signals are uniformly distributed to each element to be tested by equipping a plurality of multi-layer ceramic (MLC) blocks of a plurality of elements to be tested for receiving electrical signals on a base plate. According to the invention, signal deviation due to division by comprising one MLC block with four devices under test (DUT) can be reduced in the substrate for a probe card. Consequently, the substrate for a probe card is enabled to receive signals transmitted from a semiconductor element without giving rise to division deviation and lower the impedance mismatching. The substrate can be also applied as a high-speed high-frequency semiconductor detecting device.

Description

technical field [0001] The invention relates to a probe card for detecting the electrical characteristics of a semiconductor wafer, in particular to a probe card substrate. Background technique [0002] In general, semiconductor elements are manufactured through a fabrication step of forming a pattern on a wafer and an assembly step of assembling elements on the patterned wafer. [0003] Semiconductor elements that have completed the processing process are subjected to a chip electrical characteristic sorting (Electrical Die Sorting: hereinafter referred to as "EDS") process for testing the electrical characteristics of each element formed on each wafer before passing through the assembly process. [0004] Here, the EDS process is a process performed to identify defective elements among elements formed on a wafer. In the EDS process, a probe station that applies an electrical signal to a component on a wafer and analyzes the electrical signal that the component responds to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073
CPCG01R1/0491G01R31/2601
Inventor 金赫链田泰云金正植郑斗渊朴京锡
Owner UNIMEMS CO LTD