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Conductive paste and method for producing electronic components

A technology of electronic parts and manufacturing methods, which is applied to parts of fixed capacitors, conductive materials dispersed in non-conductive inorganic materials, fixed capacitor electrodes, etc., can solve problems such as difficulties and achieve the effect of suppressing structural defects

Inactive Publication Date: 2011-07-27
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when only one inhibitor is added, it is difficult to effectively suppress the timing deviation of shrinkage between the green sheet and the internal electrode pattern layer.

Method used

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  • Conductive paste and method for producing electronic components
  • Conductive paste and method for producing electronic components
  • Conductive paste and method for producing electronic components

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Embodiment Construction

[0028] The present invention will be described below based on the embodiments shown in the drawings.

[0029] Multilayer Ceramic Capacitors 1 Such as figure 1 As shown, the multilayer ceramic capacitor 1 according to the first embodiment of the present invention has a capacitor element main body 10 in which dielectric layers 2 and internal electrode layers 3 are alternately laminated. At both ends of the capacitor element body 10 , a pair of external electrodes 4 electrically connected to the internal electrode layers 3 alternately arranged inside the capacitor element body 10 are formed.

[0030] The internal electrode layers 3 are laminated so that the respective end faces are alternately exposed on the surfaces of the opposite end portions of the capacitor element main body 10 . Furthermore, a pair of external electrodes 4 are formed at both ends of the capacitor element main body 10 and connected to exposed end surfaces of the alternately arranged internal electrode lay...

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Abstract

A purpose of the present invention is to provide a conductive paste which is capable to prevent the structural defect and to provide a method for producing electronic components including an internal electrode layer formed by the conductive paste. A conductive paste comprises metallic particles, solvent, rein, a first inhibitor, a second inhibitor and a third inhibitor, wherein sintering start temperatures of the first inhibitor, the second inhibitor and the third inhibitor are higher than a sintering start temperature of the metallic particles, when an average particle size of the first inhibitor is defined as "a", an average particle size of the second inhibitor is defined as "b", an average particle size of the third inhibitor is defined as "c", "a", "b" and "c" fulfill a predetermined relation.

Description

technical field [0001] The present invention relates to a conductive paste and a method of manufacturing an electronic component having an internal electrode layer formed of the conductive paste. Background technique [0002] As an example of electronic parts mounted on electronic equipment, multilayer ceramic electronic parts are exemplified, and capacitors, bandpass filters, inductors, multilayer three-terminal filters, piezoelectric elements, PTC thermistors, NTC Thermistor, or piezoresistor, etc. [0003] The main body of the capacitor element constituting these multilayer ceramic electronic components is a cuboid-shaped green chip composed of, for example, a green sheet that is fired to form a dielectric layer, and a laminated layer of an internal electrode pattern that is fired to form an internal electrode layer. To produce by firing. In recent years, along with miniaturization of electronic components, there has been an increasing demand for higher density of each ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01G4/008
CPCC04B2235/3206C04B35/6262C04B2235/6584C04B2235/6582C04B2235/6562C04B35/62685C04B2235/3262C04B2235/6565H01G4/12C04B35/4682C04B2235/3418H01G4/008C04B2235/3224H01B1/22C04B2235/3248
Inventor 阿满三四郎高木敏志镰田裕纪
Owner TDK CORPARATION
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