Electronic component layout method of circuit board with adhesive surfaces on both sides
A technology of surface mount type and layout method, which is applied in the field of layout of electronic components of circuit boards, can solve the problems of complicated process steps, high manufacturing cost, and long process time, and achieve shortening of process time, reduction of manufacturing cost, and simplification of process steps Effect
Active Publication Date: 2011-07-27
广州信维电子科技股份有限公司
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[0009] In view of the above problems, the object of the present invention is to provide a method for laying out electronic components of a double-sided surface-mounted circuit board, so as to improve the double-sided surface-mounted process of the existing printed circuit board. Simultaneously complete the preparation of surface mount components and plated through hole electronic components on the side, which leads to problems such as too complicated process steps, long process time, high manufacturing cost, and difficult maintenance of processing quality
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[0044] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:
[0045] figure 1 It is a flow chart of the steps of an embodiment of the present invention, and Figure 2A to Figure 2H It is a schematic diagram of decomposition steps of an embodiment of the present invention.
[0046] Such as figure 1 shown, and please cooperate with Figure 2A Considering together, the electronic component layout method of the double-sided surface mount type circuit board disclosed in the present invention firstly provides a circuit board 300 (step 100), and this circuit board 300 has an opposite first side 310 and the second side 320, and the circuit board 300 has at least two through holes 330 passing through the first side 310 and the second side 320, and the through holes 330 described in this embodiment are plated through holes (plated through holes), so A metal layer is plated on the wall of the i...
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This invention discloses an electronic component layout method of a circuit board with adhesive surfaces on both sides, comprising the following steps of: firstly, fixing a first electronic component on a first side of a circuit board through a reflow soldering process; and then, inserting a second electronic component in the first side of the circuit board, and putting the first electronic component on the second side of the circuit board, and inserting the other second electronic component in the second side of the circuit board; at last, performing the reflow soldering process to the circuit board placed with the first and the second electronic components, thereby finishing the layout process of electronic components on the two sides of the circuit board at the same time.
Description
technical field [0001] The invention relates to a layout method of electronic components of a circuit board, in particular to a layout method of electronic components of a double-sided surface-adhesive circuit board. Background technique [0002] The printed circuit board (print circuit board, PCB) is used as an electrical carrier to gather multiple electronic components together to form a circuit system with overall functions, so the printed circuit board is indispensable for all electronic information products basic constituent elements. [0003] In order to make electronic products more miniaturized and have high reliability, the current process of combining electronic components on circuit boards has mostly adopted surface mount technology (SMT) to replace the traditional combination of through-hole inserts. Surface mount technology can quickly mount electronic components on printed circuit boards, so it has the advantages of increasing functional density, reducing weig...
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IPC IPC(8): H05K3/34H05K3/46
Inventor 吴仲扬黄弘道
Owner 广州信维电子科技股份有限公司