Production method of high-frequency four-layer circuit board

A production method and circuit board technology, which are applied in the direction of multi-layer circuit manufacturing, etc., to achieve the effects of improving production accuracy, smooth milling edges and stable performance

Active Publication Date: 2011-07-27
TAIZHOU JINDING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the production of high-frequency four-layer circuit boards is still blank in China.

Method used

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  • Production method of high-frequency four-layer circuit board
  • Production method of high-frequency four-layer circuit board

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Embodiment Construction

[0008] in figure 1 Among them, the present invention is a method for manufacturing a high-frequency four-layer circuit board, which includes the following steps: Step 1, to make engineering and light drawing materials: firstly design the template, and then perform the designed graphics according to the production process parameters Process the engineering documents to meet the production and processing requirements, and then impose the processed documents, and use the high-precision laser light drawing mechanism with a resolution of 20240dpi to make the black film of L1, L2, L3, L4 layer, and paint the light well. The negative film is washed, developed, fixed, cleaned, and air-dried; then use a 200x magnifying glass to inspect the negative film to inspect the drawn negative film, and finally use the inspected negative film as the mother to use the 3KW exposure machine to copy the diazo film, And check the copied diazo tablets. Step two, the production of cutting and drilling: ...

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Abstract

The invention discloses a production method of a high-frequency four-layer circuit board, comprising the following steps of: 1, producing engineering and plotting information; 2, cutting the board and drilling; 3, producing L2 and L3 layer patterns; 4, electroplating and etching; 5, stitching; 6, drilling at an outer layer; 7, producing the surface pattern of the high-frequency four-layer circuit board; 8, electroplating and etching on the outer layer; and 9, performing a surface solderable process and molding. The production method of the high-frequency four-layer circuit board, provided by the invention, can be used producing the circuit board with high accuracy; and the high-frequency four-layer circuit board produced by the method has stable performance.

Description

Technical field [0001] The invention relates to a manufacturing method of a high-frequency four-layer circuit board. Background technique [0002] With the development of electronic products in the direction of high speed, multi-function, large capacity, miniaturization, digitization, and high frequency, high-frequency multilayer circuit boards have the excellent characteristics of ordinary multilayer circuit boards and also have high frequency. The insulating dielectric layer has good strength, flexibility and high breakdown voltage resistance. However, the current production of high-frequency four-layer circuit boards is still blank in China. Summary of the invention [0003] The invention provides a method for manufacturing a high-frequency four-layer circuit board, which not only has high manufacturing precision, but also has stable performance of the manufactured high-frequency four-layer circuit board. [0004] The present invention adopts the following technical solutions: ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 蔡新民
Owner TAIZHOU JINDING ELECTRONICS
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