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Production method of high-frequency four-layer circuit board

A manufacturing method and circuit board technology, applied in the direction of multi-layer circuit manufacturing, etc., to achieve the effect of solving edge burrs, stable performance, and improving manufacturing accuracy

Active Publication Date: 2012-07-25
TAIZHOU JINDING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the production of high-frequency four-layer circuit boards is still blank in China.

Method used

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  • Production method of high-frequency four-layer circuit board
  • Production method of high-frequency four-layer circuit board

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Embodiment Construction

[0008] exist figure 1 Among them, the present invention is a method for manufacturing a high-frequency four-layer circuit board, which includes the following steps: Step 1, making engineering and light-painting materials: firstly, graphic design is carried out on the template, and then the designed graphics are carried out according to the production process parameters Process the engineering documents to make them meet the requirements of production and processing, then make imposition of the processed documents, and use a high-precision laser photo-painting machine with a resolution of 20240dpi to make black negatives of L1, L2, L3, and L4 layers, which is good for photo-painting Rinse, develop, fix, clean, and air-dry the negatives; then use a 200-fold magnifying glass to check the negatives and check the drawn negatives, and finally use a 3KW exposure machine to copy the diazo film based on the checked negatives. And check the copied diazo tablets. Step 2, the production ...

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Abstract

The invention discloses a production method of a high-frequency four-layer circuit board, comprising the following steps of: 1, producing engineering and plotting information; 2, cutting the board and drilling; 3, producing L2 and L3 layer patterns; 4, electroplating and etching; 5, stitching; 6, drilling at an outer layer; 7, producing the surface pattern of the high-frequency four-layer circuitboard; 8, electroplating and etching on the outer layer; and 9, performing a surface solderable process and molding. The production method of the high-frequency four-layer circuit board, provided by the invention, can be used producing the circuit board with high accuracy; and the high-frequency four-layer circuit board produced by the method has stable performance.

Description

technical field [0001] The invention relates to a manufacturing method of a high-frequency four-layer circuit board. Background technique [0002] With the development of electronic products in the direction of high speed, multi-function, large capacity, miniaturization, digitization, and high frequency, high-frequency multilayer circuit boards not only have the excellent characteristics of ordinary multilayer circuit boards, but also have high frequency, The insulating dielectric layer has good strength, flexibility and high breakdown voltage. However, the production of high-frequency four-layer circuit boards is still blank in China. Contents of the invention [0003] The invention provides a method for manufacturing a high-frequency four-layer circuit board, which not only has high manufacturing precision, but also has stable performance of the manufactured high-frequency four-layer circuit board. [0004] The present invention adopts the following technical solutions...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 蔡新民
Owner TAIZHOU JINDING ELECTRONICS
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