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Dual-axle integrated fully-coupled silicon micro-resonance type accelerometer

A technology of micro-accelerometer and accelerometer, which is applied in the direction of measurement of acceleration, multi-dimensional acceleration measurement, speed/acceleration/impact measurement, etc. It can solve the problems of poor performance consistency of the two detection axes, large cross-axis coupling, and large volume, etc., to achieve convenience The effect of driving combs and driving feedback combs, reducing nonlinearity, and suppressing common-mode interference

Inactive Publication Date: 2012-06-13
SOUTHEAST UNIV
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  • Claims
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Problems solved by technology

However, at present, most institutions are developing uniaxial silicon microresonant accelerometers, and a few institutions have conducted preliminary theoretical and experimental discussions on biaxial silicon microresonant accelerometers. Existing biaxial silicon microresonant accelerometers have crossover Disadvantages such as large axis coupling, poor performance consistency of the two detection axes, and large volume

Method used

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  • Dual-axle integrated fully-coupled silicon micro-resonance type accelerometer
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  • Dual-axle integrated fully-coupled silicon micro-resonance type accelerometer

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Embodiment Construction

[0016] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

[0017] Such as figure 1 As shown, the dual-axis integrated fully decoupled silicon microresonant accelerometer of the present invention is used to measure the acceleration input along two vertical directions in the same plane. Micro-accelerometer structure, the lower layer is the signal leads made on the glass base 16. The upper mechanical structure of the micro accelerometer consists of a mass block 1 and four identical and symmetrically distributed resonator substruct...

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Abstract

The invention discloses a dual-axle integrated fully-coupled silicon micro-resonance type accelerometer which comprises an upper-layer micro accelerometer structure and a lower-layer glass base, wherein the micro accelerometer structure is bonded on the glass base, the glass base is provided with a signal lead, an electrode of the micro accelerometer structure is connected with a corresponding signal lead, and the micro accelerometer structure comprises a mass block and four completely same resonator substructures. The dual-axle integrated fully-coupled silicon micro-resonance type accelerometer adopts frequency detection, and two detecting axles are fully coupled and arranged symmetrically; and the dual-axle integrated fully-coupled silicon micro-resonance type accelerometer has the advantages of simple and compact structure, small volume and high accuracy.

Description

technical field [0001] The invention belongs to the technical field of micro-electromechanical systems and micro-inertial measurement, and in particular relates to a silicon micro-resonance accelerometer. Background technique [0002] Silicon micro-accelerometer has the characteristics of small size, light weight, low cost, low energy consumption, high reliability, easy digitization, and can meet harsh environment applications. It has important military value and broad application prospects. Most silicon micro-accelerometers use capacitive detection methods, which have the advantages of small temperature drift, high sensitivity, good reliability and good stability, but with the greatly reduced structure size of silicon micro-accelerometers, the sensitivity of the instrument The resolution and resolution are greatly reduced, and the capacitance detection method is greatly affected by parasitic effects, mechanical structure noise, circuit noise, etc., and has basically reached...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/125B81B3/00G01P15/14G01P15/18
Inventor 杨波殷勇黄丽斌王寿荣李宏生陈卫卫
Owner SOUTHEAST UNIV
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