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Laminate composite scrap thermal modification treatment equipment and method

A processing equipment and thermal modification technology, applied in the field of thermal modification processing equipment for laminated composite waste, to achieve good thermal modification effect

Active Publication Date: 2014-04-16
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the technology of low-temperature thermal shock modification has not been reported for the modification and crushing of waste circuit boards.

Method used

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  • Laminate composite scrap thermal modification treatment equipment and method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1 Thermal Modification Treatment of Waste Circuit Board Leftovers

[0030] A heat treatment method for laminated composite waste, comprising the following steps:

[0031] In the first step, put the waste circuit board in the circular vacuum furnace 4, close the circular vacuum furnace 4, vacuumize, the vacuum pressure is 300Pa, and then raise the temperature at a rate of 8°C / min, and keep it warm after reaching 240°C. After 15 minutes, turn off the power and let it cool down naturally. After cooling down to 110°C, release the vacuum and return to normal pressure, turn on the circular vacuum furnace 4, and take out the waste;

[0032] The second step is to choose the angle-cut type-crusher to crush the waste and pass it through a 2mm sieve. The degree of dissociation between metal and non-metal is increased to 90-98%, achieving full dissociation;

[0033] In the third step, the crushed material is pretreated by hammer milling and then sorted by a high-voltage...

Embodiment 2

[0034] Embodiment 2 The thermal modification treatment of the main computer motherboard after the components are removed

[0035] A thermal modification treatment method for laminated composite waste, comprising the following steps:

[0036] In the first step, put the waste circuit board in the circular vacuum furnace 4, close the circular vacuum furnace 4, vacuumize, the vacuum pressure is 800Pa, and then raise the temperature at a rate of 10°C / min, and keep it warm after reaching 230°C. After 12 minutes, turn off the power and let it cool down naturally. After cooling down to 140°C, release the vacuum and return to normal pressure, turn on the circular vacuum furnace 4, and take out the waste;

[0037] The second step is to choose an angle-cut crusher and pass through a 4mm sieve to crush the waste, and the degree of dissociation is increased to 90-98% to achieve full dissociation;

[0038] In the third step, the crushed material is pretreated by hammer milling and then sor...

Embodiment 3

[0039] Embodiment 3 Thermal Modification Treatment of the Host Graphics Card After the Components Are Removed

[0040] A thermal modification treatment method for laminated composite waste, comprising the following steps:

[0041] In the first step, put the waste circuit board in the circular vacuum furnace 4, close the circular vacuum furnace 4, vacuumize, the vacuum pressure is 1000Pa, and then raise the temperature at a rate of 14°C / min, and keep it warm after reaching 220°C. After 8 minutes, turn off the power and let it cool down naturally. After cooling down to 120°C, release the vacuum and return to normal pressure, turn on the circular vacuum furnace 4, and take out the waste;

[0042] In the second step, select the angle-cut type-crusher to crush the waste and pass it through a 5mm sieve, and the degree of dissociation is increased to 90-98%, achieving full dissociation;

[0043] In the third step, the crushed material is pretreated by hammer milling and then sorted ...

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Abstract

The invention provides a laminate composite scrap thermal modification treatment equipment and method. The equipment comprises a round vacuum furnace, wherein a heating pipe is arranged in the round vacuum furnace; one side of the round vacuum furnace is communicated with a vacuum pump; the heating pipe, the vacuum pump and a control cabinet are connected; a furnace door is arranged at the other side of the round vacuum furnace; and a material loading truck is arranged outside the furnace door of the round vacuum furnace and is connected with the round vacuum furnace through a guide rail. The method comprises the following step of: conveying scrap into the round vacuum furnace through the furnace door by the material loading truck; heating, carrying out heat insulation, and naturally cooled; then releasing vacuum and recovering to normal pressure, and taking out the scrap; crushing by using an angular cut crusher and then sieving; and finally carrying out metal sorting and recycling. The equipment and the method can realize microscopic separation and microscopic damage of adhesion among composite material layers, and have excellent thermal modification effect.

Description

technical field [0001] The invention belongs to the technical field of electronic waste resource treatment, and in particular relates to a thermal modification treatment equipment and method for laminated composite waste. Background technique [0002] Electronic waste is a key and hot issue in the environmental management of solid waste. Among them, the circuit board is the most basic and indispensable component of electronic and electrical equipment. With the rapid development of the information industry, the replacement speed of electrical and electronic equipment is continuously increasing, and the amount of discarded circuit boards is also increasing sharply. Mechanophysical methods are the mainstream technology for recycling waste circuit boards. Mechanophysical technology generally includes two main process links: crushing and sorting, among which crushing is the primary key link of mechanical physical technology. In the process of crushing solid waste, conventional m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B09B5/00B09B3/00C22B7/00C22B15/00
CPCY02W30/82
Inventor 李金惠段华波黄伟朱孝东
Owner TSINGHUA UNIV