Method for doubly setting and accurately positioning centre of silicon slice
A precise positioning, silicon wafer technology, applied in measuring devices, instruments, electrical components, etc., can solve the problems of strict requirements on the camera environment and excessive focusing distance, saving transmission time, eliminating secondary errors, and simple and high-speed setting methods. Effect
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[0050] Embodiment 1, set the diameter of the silicon wafer to be 2 inches
[0051] First, place the processing carrier silicon wafer D on the wafer stage; then rotate the silicon wafer D counterclockwise with a rotation angle of 30°, and at the same time, the edge of the silicon wafer is detected by a low-precision linear image recognition sensor installed on the side of the edge of the silicon wafer. Detection; the detection value is calculated by formulas (1), (2), (3), and (4), and the position of the flat edge or notch of the silicon wafer and the center of the circle are located; in the first time, the distance d from the sensor to the center O of the wafer stage =35mm, the angular velocity of the silicon wafer rotation is ω=0.1047 radian / second; the moment t when the timing starts 0 is: 0s, timing time t 1 For: 1s, t 2 is: 2s, t 3 is: 3s, the time t to stop timing is: 5s; time t 1 , time t 2 , time t 3 , the distance from the corresponding sensor to the edge of the...
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