Semiconductor device and producing method thereof

Abstract

The invention discloses a three-dimensional semiconductor packaging using an interposer. The invention provides a semiconductor device and a producing method thereof. The semiconductor device comprises a first chip whose first side is electrically coupled to the interposer and a second chip whose second side is electrically coupled to the interposer. The interposer is electrically coupled to a below substrate, such as a packaging substrate, a high-density interconnector, a printed circuit board and so on. The substrate is provided with a recess, making a second chip being disposed in the recess. The recess allows using quite a small conductive bump, thereby quite a large amount of conductive bumps can be used. A radiating fin can be placed in the recess to assist the second chip to dissipate heat.

Description

technical field [0001] The present invention relates to a semiconductor device and a manufacturing method thereof, in particular to a three-dimensional semiconductor package using an interposer. Background technique [0002] Since the invention of the integrated circuit, the semiconductor industry has continued to grow rapidly due to continuous improvements in the integration density of various electronic components (ie, transistors, diodes, resistors, capacitors, etc.). Mainly, the improvement of integration level comes from the continuous shrinking of the minimum feature size, which allows more components to be integrated into the existing chip area. [0003] These improvements in integration are essentially two-dimensional (2D), since the volume occupied by the integrated components is actually located on the surface of the semiconductor wafer. Although advances in lithography technology have brought considerable benefits to the fabrication of 2D integrated circuits, the...

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Problems solved by technology

However, PoP packaging is difficult to reduce the form factor

Additionally, pack

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