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SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation

A liquid and patch technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of inability to achieve high heat dissipation efficiency and insufficient heat dissipation speed, and achieve effective heat generation, prolong life, and reduce prices.

Inactive Publication Date: 2011-08-31
杭州慈源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in general traditional LED packaging technology, the bonding of the LED and the heat dissipation base uses viscous heat dissipation glue or heat dissipation paste. Mixed in the polymer resin, even if the thermal conductivity is good, it is a dielectric layer of different material from the metal surface of the LED and the metal layer of the heat dissipation base, which cannot achieve high heat dissipation efficiency, and the heat dissipation speed is not fast enough

Method used

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  • SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation
  • SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation
  • SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation

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Embodiment Construction

[0013] The specific implementation of the liquid-dissipated SMD LED of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0014] Such as figure 1 Shown, a kind of patch LED of liquid heat dissipation, it is mainly made up of base 2, pin 3, plastic base 4, lens 5 and chip, and it also includes the heat dissipation crystal plate 6 and heat dissipation plate 6 on the back side of LED base 2 The heat dissipation part is composed of the liquid heat dissipation cover 11 surrounded by the crystal plate 6; the liquid heat dissipation cover 1 is an inverted funnel, and the liquid heat dissipation cover 1 is equipped with heat dissipation liquid 7.

[0015] Such as figure 2 As shown, when the SMD LED is connected to the circuit board 9, the pin 3 of the LED is welded to the circuit board 9, and taper holes are opened on the circuit board 9 to embed the liquid cooling cover 1 into the circuit board 9 as a whole. The circuit board 9...

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Abstract

The invention relates to an SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation, and the SMD LED is characterized by mainly comprising a substrate, pins, a rubber base, a lens, a wafer and a heat dissipation part, wherein the heat dissipation part comprises a heat dissipation wafer on the back surface of the LED substrate and a liquid heat dissipation cover which surrounds the heat dissipation wafer; the liquid heat dissipation cover is an inverted funnel; and a heat dissipation liquid is filled in the liquid heat dissipation cover. The SMD LED provided by the invention can be used for solving the defects of the existing LED and has the characteristics of good heat dissipation effect, high heat dissipation speed, long service life, environment friendliness and the like.

Description

technical field [0001] The invention relates to an LED, in particular to a chip LED which uses liquid to dissipate heat. Background technique [0002] With the development of LED, LED light source has the advantages of using low-voltage power supply, less energy consumption, strong applicability, high stability, short response time, no pollution to the environment, and multi-color light emission. Therefore, the wide application of LED has become a development trend. [0003] Since the LED will generate a lot of heat during the light-emitting process, an appropriate heat dissipation device must be provided to avoid damage to the life of the light-emitting chip itself. However, in general traditional LED packaging technology, the bonding of the LED and the heat dissipation base uses viscous heat dissipation glue or heat dissipation paste. Mixed in the polymer resin, even if the thermal conductivity is good, it is a dielectric layer of different material from the metal surfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
Inventor 王宝根崔黎明温必文
Owner 杭州慈源科技有限公司
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