Low-temperature cofired PTC (Positive Temperature Coefficient) ceramic material component

A ceramic material, low temperature co-firing technology, applied in the field of new PTC ceramic material composition, can solve the problem of PbO-BN glass phase reducing the sintering temperature of PTC ceramic material, etc., and achieve the effect of a wide range of applications

Inactive Publication Date: 2011-09-07
CHENGDU SHUNKANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Judging from the recently announced technology, there has been no report on the use of PbO-BN glass phases to red

Method used

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  • Low-temperature cofired PTC (Positive Temperature Coefficient) ceramic material component
  • Low-temperature cofired PTC (Positive Temperature Coefficient) ceramic material component
  • Low-temperature cofired PTC (Positive Temperature Coefficient) ceramic material component

Examples

Experimental program
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Effect test

Embodiment 1

[0013] A low-temperature co-fired PTC ceramic material composition is composed of a ceramic phase and a glass phase. The ceramic phase is a common PTC ceramic material, and the glass phase is a PbO-BN series material. The molar ratio of PbO-BN material is 1.5. Now the weight percentage of PbO and BN is: PbO: BN=93: 7 (wt %)

[0014] PTC ceramic materials need to be synthesized in advance, and the synthesis process is as follows:

[0015] BaCO 3 、TiO 2 , Y 2 o 3 , SrCO 3 , CaCO 3 , SiO 2 and Mn(NO 3 ) 2 , according to the chemical equation (1) of the following common PTC ceramic materials:

[0016] Ba 0.85 Ca 0.15 Ti 1.01 o 3 +0.25mol% Y 2 o 3 +2.4mol% SiO 2 +0.08mol%Mn(NO 3 ) 2 (1)

[0017] Mixing ingredients-ball milling-drying-pre-calcination synthesis, the temperature of pre-calcination synthesis is preferably 1100°C to 1200°C.

[0018] PbO-BN materials need to be mixed in advance, and the mixing process is as follows:

[0019] The molar ratio of ...

Embodiment 2

[0027] A low-temperature co-fired PTC ceramic material composition is composed of a ceramic phase and a glass phase. The ceramic phase is common PTC ceramic material, and the glass phase is PbO-BN material. The molar ratio of PbO-BN material is 2. Now the weight percentage of PbO and BN is: PbO: BN=95: 5 (wt %)

[0028] PTC ceramic materials need to be synthesized in advance, and the synthesis process is as follows:

[0029] BaCO 3 、TiO 2 , Y 2 o 3 , SrCO 3 , CaCO 3 , SiO 2 and Mn(NO 3 ) 2 , according to the chemical equation (1) of the following common PTC ceramic materials:

[0030] Ba 0.85 Ca 0.15 Ti 1.01 o 3 +0.25mol% Y 2 o 3 +2.4mol% SiO 2 +0.08mol%Mn(NO 3 ) 2 (1)

[0031] Mixing ingredients-ball milling-drying-pre-calcination synthesis, the temperature of pre-calcination synthesis is preferably 1100°C to 1200°C.

[0032] PbO-BN materials need to be mixed in advance, and the mixing process is as follows:

[0033] The molar ratio of PbO and BN is...

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Abstract

The invention relates to a novel PTC (Positive Temperature Coefficient) ceramic material component, in particular to a low-temperature cofired PTC ceramic material component. The low-temperature cofired PTC ceramic material component comprises a ceramic phase and a glass phase. The low-temperature cofired PTC ceramic material component is characterized in that the ceramic phase is a conventional PTC ceramic material; the glass phase is a PbO-BN material; the content of the PbO-BN material is 1-10 percent by weight; and the content of the PTC ceramic material is 90-99 percent by weight. The product reduces the sintering temperature of the PTC ceramic material by adopting the PbO-BN glass phase and also has high-performance PTC characteristic and wide application range.

Description

technical field [0001] The invention relates to a novel PTC ceramic material composition, specifically, a low-temperature co-fired PTC ceramic material composition. Background technique [0002] In recent years, driven by the rapid development of semiconductor technology, electronic components continue to develop in the direction of miniaturization, integration and high frequency. With the rapid development of SMT technology, it has greatly promoted the miniaturization, miniaturization, integration and chipping of electronic equipment and electronic components, and the development and preparation of chip and miniaturized PTC components with multi-layer structure It has become a research hotspot and focus at home and abroad. In order to achieve chipping and miniaturization of multilayer PTC components, the PTC material used must have a good PTC effect, high withstand voltage, and low resistivity under low-temperature sintering conditions; Microcircuits and other wider appli...

Claims

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Application Information

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IPC IPC(8): C04B35/468
Inventor 杨敬义章旭
Owner CHENGDU SHUNKANG ELECTRONICS
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