Equidensity mortar cutting method for linear cutting of solar wafer

Abstract

The invention discloses an equidensity mortar cutting method and an equidensity mortar cutting device for linear cutting of a solar wafer. The device comprises a mortar cylinder (101), an equidensity mortar adjustment device (112), a cold-heat exchanger (102), a flow distribution nozzle (103), a linear roller (106), a cutting steel wire (107) and a mortar groove (109). The method comprises the following steps of: arranging the equidensity mortar cutting device on an NTC442 slicing machine; preparing equidensity cut mortar; collecting the density curves of first five quires of the NTC slicing machine along with the variation of slicing time before the device is used; adjusting a mortar density adjustment compensator according to the average variation curve of the first five quires so as to establish a referential variation curve; monitoring the mortar used during cutting by using a mortar density real-time detector; and replacing a new silicon rod material, performing cutting processes from a second quire to a fifth quire, and adding an equidensity mortar modifier. By the method and the device, the cutting efficiency is improved from the original 2.5 quires to 3.5 quires every day, namely the cutting efficiency is improved by 40 percent, and the utilization ratio of equipment is improved by 20 percent.

Description

technical field [0001] The invention relates to an equal density mortar cutting method and device for wire cutting of solar silicon wafers. Background technique [0002] China's photovoltaic power generation industry has developed rapidly in recent years. The number of solar silicon wafer cutting equipment has increased by 30% to 50% every year, and the demand for cutting mortar has reached about 1200-1500 tons per day. [0003] In the process of wire cutting of solar silicon wafers, the whole mechanism is to use the hard characteristics and sharp water chestnuts of silicon carbide particles to gradually cut off the silicon rods. It is required that the silicon carbide particles in the cutting mortar can be uniformly and stably dispersed in the cutting mortar system and maintain continuous stability. The mortar density and the mortar supply amount make the mortar evenly cover the surface of the steel wire in high-speed movement, and make the silicon carbide particles act...

AI Technical Summary

Problems solved by technology

The invention solves the change of the mortar environment and process during the cutting caused by the increase of the mortar density and viscosity with the increase of the cutting time during the cutting process of the conventional silicon carbide mortar, resulting in the change of the slice thickness and surface roughness of the silicon wafer

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