Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof

A technology of epoxy resin glue and prepreg, which is applied in the direction of chemical instruments and methods, semiconductor devices, circuit substrate materials, etc., can solve the problems of energy waste, easy light transmission of copper clad laminates, etc., and achieve good light-shielding and chemical resistance effects

Active Publication Date: 2011-09-21
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the defect that the copper-clad laminates in the prior art are easy to transmit light, thereby causing en

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] 1. The formula of epoxy resin glue is shown in Table 1.

[0036] Two, the preparation method of epoxy resin glue is: dissolve dicyandiamide with dimethylformamide according to the formula listed in table 1, add dimethylimidazole, stir and dissolve for 6 hours; The phenol A resin was mixed and stirred for 4 hours; after adding aluminum hydroxide and nigrosine, it was stirred and matured for 6 hours.

[0037] 3. The preparation method of the prepreg is as follows: immerse the glass cloth in the epoxy resin glue, bake in an oven at 185°C for 2.5 minutes, and cool to below 40°C to obtain the prepreg.

[0038] 4. The performance parameters of the prepreg are shown in Table 1, and the gel time of the prepreg is measured at 171°C.

[0039] 5. The preparation method of FR-4 copper clad laminate: After stacking 6 prepregs into a core block, apply copper foil on one side of the core block, and the thickness of the copper foil is 1OZ; stack the stacked plates and stainless steel ...

Embodiment 2

[0044] 1. The formula of epoxy resin glue is shown in Table 2.

[0045] Two, the preparation method of epoxy resin glue is: dissolve dicyandiamide with dimethylformamide according to the formula listed in table 2, add dimethylimidazole, stir and dissolve for 6 hours; The phenol A resin was mixed and stirred for 4 hours; after adding aluminum hydroxide and nigrosine, it was stirred and matured for 6 hours.

[0046] 3. The preparation method of the prepreg is as follows: immerse the glass cloth in the epoxy resin glue, bake in an oven at 200°C for 2 minutes, and cool to below 40°C to obtain the prepreg.

[0047] 4. The performance parameters of the prepreg are shown in Table 2, wherein the gel time of the prepreg is measured at 171°C.

[0048] 5. The preparation method of FR-4 copper clad laminate: After stacking 4 prepregs into a core block, apply copper foil on both sides of the core block, the thickness of the copper foil is 0.5OZ; place the laminated plate and the stainless...

Embodiment 3

[0053] 1. The formula of epoxy resin glue is shown in Table 3.

[0054] Two, the preparation method of epoxy resin glue is: dissolve dicyandiamide with dimethylformamide according to the formula listed in table 3, add dimethylimidazole, stir and dissolve for 6 hours; The phenol A resin was mixed and stirred for 4 hours; after adding aluminum hydroxide and nigrosine, it was stirred and matured for 6 hours.

[0055] 3. The preparation method of the prepreg is as follows: immerse the glass cloth in the epoxy resin glue solution, bake in an oven at 150°C for 5 minutes, and cool to below 40°C to obtain the prepreg.

[0056]4. The performance parameters of the prepreg are shown in Table 3, wherein the gel time of the prepreg is measured at 171°C.

[0057] 5. The preparation method of FR-4 copper clad laminate: After stacking 8 prepregs into a core block, apply copper foil on both sides of the core block. After stacking, put it into a vacuum press, heat it from 100°C to 185°C, pres...

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PUM

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Abstract

The invention provides an epoxy resin glue solution comprising brominated bisphenol A resin, dicyandiamide, dimethylimidazole, inorganic filling materials, aniline and solvents, wherein, the inorganic filling materials comprise aluminium hydroxide. The invention also provides a preparation method for the epoxy resin glue solution, and an application of the epoxy resin glue solution for preparing a prepreg and a FR-4 copper-clad panel. The invention further provides the prepreg and FR-4 copper-clad panel prepared by using the epoxy resin glue solution, and a preparation method for the prepreg and FR-4 copper-clad panel. According to the invention, the defect of energy wasting caused by high light transmittance existing in the copper-clad panel in the prior art is overcome. The prepreg and FR-4 copper-clad panel prepared by using the epoxy resin glue solution disclosed in the invention can be used as a black substrate without affecting other performances of the substrate. The copper-clad panel can reduce the light transmittance and is suitable for using as an LED substrate.

Description

technical field [0001] The present invention relates to the field of copper-clad laminates, in particular to an epoxy resin glue and a preparation method thereof, and in particular to a prepreg and FR-4 copper-clad laminate prepared from the epoxy resin glue and their preparation methods. Background technique [0002] Due to the outstanding characteristics of low energy consumption and high efficiency of LED (light-emitting diode), LED has been widely used in electrical indication, LED display, LCD backlight, landscape lighting, interior decoration and other fields. The rapid development of LED has also promoted the development of functional copper-clad laminates. The reason why it is called functional copper-clad laminates is that the copper-clad laminates used for LEDs provide the required insulating substrates, conductive copper foils, and signals in addition to ordinary copper-clad laminates. In addition to transmission, the substrate also needs to have a good shading fu...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08K13/02C08K5/315C08K5/3445C08K3/22B32B15/14B32B17/04H05K1/03H01L33/48
Inventor 韩涛
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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