Substrate for power module, preparing method thereof, substrate with heat radiator and power module

Abstract

The present invention provides a substrate for a power module, a preparing method thereof, a substrate for the power module with a heat radiator, and the power module thereof. In thermal circulation load, the power module can restrain fluctuation or corrugation on a surface of a circuit layer. Furthermore, application of a thermal stress on a joint interface between a ceramic substrate and the circuit layer can be restrained. Additionally, the substrate for the power module has excellent thermal circulation reliability. The substrate (10) for the power module is provided with an aluminum circuit layer (12) on one surface of the ceramic substrate (11), wherein, the circuit layer (12) is provided with a body layer (12B) and a hardened surface layer (12A) which is configured exposed at the surface side. The indentation hardness (Hs) of the surface of the circuit layer (12) is set in a range between 50mgf/mu m2 and 200mgf/mu m2. More than 80% of the area of the indentation hardness (Hs) becomes the hardened surface layer (12A). The indentation hardness (Hb) of the body layer (12B) is less than 80% of the indentation hardness (Hs).

Description

technical field [0001] The present invention relates to a substrate for a power module including a circuit layer on which electronic components such as semiconductor elements are mounted, a method for manufacturing the substrate for a power module, a substrate for a power module with a heat sink using the substrate for a power module, and a power module . Background technique [0002] Since the power element used for power supply among semiconductor elements has relatively high heat generation, as the substrate on which the power element is mounted, for example, as shown in Patent Document 1, the following power module substrate is widely used: a substrate made of AlN (nitrogen Al (aluminum) metal plate to be a circuit layer is bonded to a ceramic substrate made of Al-Si based brazing filler metal. [0003] Furthermore, for example, as shown in Patent Documents 2 to 4, there is proposed a substrate for a power module in which an aluminum alloy member is bonded to a ceramic ...

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Problems solved by technology

[0010] However, when the circuit layer is made of aluminum with a relatively low deformation resistance such as 99.99% or higher purity (4N aluminum), there is a problem that undulations or wrinkles are generated

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