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Electronic assembly body

A technology of assembly and electronic components, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of poor heat dissipation efficiency, low thermal conductivity, poor heat conduction effect of circuit boards, etc., and achieve good heat dissipation effect

Inactive Publication Date: 2011-09-21
林总贤 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of the material of the insulating layer in the existing circuit board is low, so overall, the thermal conductivity of the existing circuit board is poor, making the heat-dissipating efficiency of the existing electronic assembly ) poor

Method used

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Embodiment Construction

[0031] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and effects of the electronic device proposed in accordance with the present invention will be described in detail below with reference to the drawings and embodiments Rear.

[0032] [First set of embodiments]

[0033] Figure 1A A schematic cross-sectional view of an electronic assembly according to the first group of embodiments of the present invention is shown. Please refer to Figure 1A The electronic assembly 200 of the first group of embodiments includes a first substrate 210, a plurality of electronic modules 220, and a plurality of heat dissipation devices 230. The first substrate 210 includes two first conductive layers 212 and a first insulating layer 214 and has a plurality of through holes 216. The first conductive layers 212 are respectively disposed on two opposite sides of the f...

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Abstract

The invention relates to an electronic assembly body which comprises a first base plate and an electrical module, wherein, the first base plate comprises a first conductor layer and a first insulating layer; the first conductor layer is arranged on the first insulating layer; the electrical module comprises a second base plate and an electrical assembly; the second base plate is arranged on the first base plate and comprises a second conductor layer and a second insulation layer; the second conductor layer is arranged on the second insulating layer; the coefficient of heat conductivity of the second insulating layer is larger than that of the first insulating layer; the electrical assembly is conductively connected on the second base plate and is electrically connected with the first base plate; and the heat dissipation efficiency of the electronic assembly body is better.

Description

Technical field [0001] The present invention relates to an electronic device, and particularly relates to an electronic assembly. Background technique [0002] In the semiconductor industry, the production of integrated circuits (IC) can be divided into three stages: IC design, IC process, and IC package. In the production of integrated circuits, a chip is completed through the steps of manufacturing a wafer, forming an integrated circuit, and dicing a wafer (wafersawing). The wafer has an active surface, which generally refers to the surface of the wafer with active elements. After the integrated circuit inside the wafer is completed, the active surface of the wafer is further configured with multiple pads, and the active surface of the wafer is further covered by a passivation layer. The protective layer exposes the pads, so that the chip finally formed by wafer dicing can be electrically connected to a carrier through the pads. The carrier is, for example, a leadframe or a ...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L23/14H01L23/367
CPCH01L2224/48091H01L2224/16225H01L2224/73204H01L2224/48227H01L2224/32225H01L2224/73253H01L2924/00014H01L2924/00
Inventor 林总贤林智明
Owner 林总贤
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