Electronic assembly body
A technology of assembly and electronic components, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of poor heat dissipation efficiency, poor heat conduction effect of circuit boards, low thermal conductivity, etc., and achieve the effect of good heat dissipation efficiency
Inactive Publication Date: 2014-01-29
林总贤 +1
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Problems solved by technology
However, the thermal conductivity of the material of the insulating layer in the existing circuit board is low, so overall, the heat conduction effect of the existing circuit board is poor, making the heat-dissipating efficiency of the existing electronic assembly ) poor
Method used
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Embodiment Construction
[0031] In order to further explain the technical means and functions adopted by the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and functions of the electronic device proposed according to the present invention will be described in detail below in conjunction with the accompanying drawings and examples. rear.
[0032] [First set of examples]
[0033] Figure 1A A schematic cross-sectional view of an electronic assembly according to a first group of embodiments of the present invention is shown. Please refer to Figure 1A , the electronic assembly 200 of the first embodiment includes a first substrate 210 , a plurality of electronic modules 220 and a plurality of heat sinks 230 . The first substrate 210 includes two first conductive layers 212 and a first insulating layer 214 and has a plurality of through holes 216 . The first conductive layers 212 are respectively disposed on opposite sides of t...
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The invention relates to an electronic assembly body which comprises a first base plate and an electrical module, wherein, the first base plate comprises a first conductor layer and a first insulating layer; the first conductor layer is arranged on the first insulating layer; the electrical module comprises a second base plate and an electrical assembly; the second base plate is arranged on the first base plate and comprises a second conductor layer and a second insulation layer; the second conductor layer is arranged on the second insulating layer; the coefficient of heat conductivity of the second insulating layer is larger than that of the first insulating layer; the electrical assembly is conductively connected on the second base plate and is electrically connected with the first base plate; and the heat dissipation efficiency of the electronic assembly body is better.
Description
technical field [0001] The present invention relates to an electronic device, and in particular to an electronic assembly. Background technique [0002] In the semiconductor industry, the production of integrated circuits (IC) can be mainly divided into three stages: integrated circuit design (IC design), integrated circuit production (IC process) and integrated circuit packaging (IC package). In the manufacture of integrated circuits, chips are completed through the steps of making wafers, forming integrated circuits, and cutting wafers. The wafer has an active surface, which generally refers to the surface of the wafer with active elements. After the integrated circuit inside the wafer is completed, the active surface of the wafer is further equipped with a plurality of pads, and the active surface of the wafer is further covered by a passivation layer. The protection layer exposes each pad, so that the chips finally formed by dicing the wafer can be electrically connect...
Claims
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IPC IPC(8): H01L25/00H01L23/14H01L23/367
CPCH01L2224/73253H01L2224/73204H01L2224/48091H01L2224/16225H01L2224/48227H01L2224/32225
Inventor 林总贤林智明
Owner 林总贤