WOLED (white organic light-emitting device) and manufacturing method thereof
An electroluminescent device, organic technology, applied in chemical instruments and methods, semiconductor/solid-state device manufacturing, luminescent materials, etc., can solve the problems of increased difficulty in device structure and manufacturing process, reduce luminescence quenching, and improve utilization efficiency and reduce energy loss
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Embodiment 1
[0064] Such as figure 2 As shown, the substrate 1 of the device is a glass substrate, the anode layer 2 is ITO, the hole transport material 3 is NPB, the electron transport material 5 is Bphen, the complementary phosphorescent material 41 is tbt, and the hole transport and energy transfer material 42 is mCP, the single doping material 43 is FIr6, the main material is UGH2, and the cathode layer 6 is Mg:Ag alloy. The entire device structure is described as:
[0065] Glass substrate / ITO / NPB / tbt(0.1nm) / mCP / UGH2:10%FIr6(20nm) / Bphen / Mg:Ag(200nm)
[0066] The preparation method is as follows:
[0067] ①Use detergent, ethanol solution, deionized water and alcohol to ultrasonically clean the transparent conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. Wherein the ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 10Ω / sq, and the film thickness is 180nm.
[0068] ②The dried substrate was mo...
Embodiment 2
[0077] Such as figure 2 As shown, the substrate 1 of the device is a glass substrate, the anode layer 2 is ITO, the hole transport material 3 is NPB, and the complementary phosphorescent material 41 in the structure of the device is (pbi) 2 Ir(acac), the hole transport and energy transfer material 42 is mCP, the single doping material 43 is FIrpic, the host material is UGH2, the electron transport material 5 is Bphen, and the cathode layer 6 is Mg:Ag alloy. The entire device structure is described as:
[0078] Glass substrate / ITO / NPB / (pbi) 2 Ir(acac)(1nm) / mCP / UGH2:10%FIrpic(20nm) / Bphen / Mg:Ag(200nm)
[0079] The fabrication process of the device is similar to that of Example 1.
Embodiment 3
[0081] Such as figure 2 As shown, the substrate 1 of the device is a glass substrate, the anode layer 2 is ITO, the hole transport material 3 is NPB, and the complementary phosphorescent material 41 in the structure of the device is (tpbi) 2 Ir(acac), the hole transport and energy transfer material 42 is mCP, the single doping material 43 is FIr6, the host material is UGH2, the electron transport material 5 is Bphen, and the cathode layer 6 is Mg:Ag alloy. The entire device structure is described as:
[0082] Glass substrate / ITO / NPB / (tpbi) 2 Ir(acac)(2nm) / mCP / UGH2:10%FIr6(20nm) / Bphen / Mg:Ag(200nm)
[0083] The fabrication process of the device is similar to that of Example 1.
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