LED (light-emitting diode) light source module and packaging process thereof
An LED light source, LED chip technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of complex circuit connections, difficult to meet the requirements of light color uniformity and heat dissipation performance, achieve uniform light color, reduce open circuits, Good heat dissipation effect
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[0012] In order to further understand the features, technical means, and specific goals and functions of the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.
[0013] see figure 1 and figure 2 The LED light source module of the present invention includes a plurality of light source units and a substrate 30 . The light source unit includes a silicon wafer 10 and a chip array 20 .
[0014] see figure 2 The silicon wafer 10 is made of insulating materials such as ceramics. The silicon wafer 10 includes an upper surface 11 and a welding surface 12 . The upper surface 11 is provided with a circuit. The silicon wafer 10 is provided with a number of through holes 13 . The chip array 20 includes a plurality of LED chips 21 . The LED chips 21 are soldered on the through holes 13 , and the LED chips 21 are connected to the circuits on the upper surface 11 and the soldering surface...
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