Multiple-photoelectric thin board spliced yin and yang jig
A thin plate, yin and yang technology, which is applied in the field of multi-splicing yin and yang fixtures for small-sized and high-precision photoelectric thin plates, can solve the input cost of SMT increasing line and manpower, the inability of mounting equipment to mount stably, and the imbalance of SMT line and CT. problems, to achieve the effect of improving the integration speed and process quality of SMT process, reducing labor intensity and production cost, and avoiding deformation
Inactive Publication Date: 2013-03-20
昆山元崧电子科技有限公司
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Problems solved by technology
[0004]a. If the number of unit points is small, the CT of the SMT wire body will be seriously unbalanced, and the output cannot be maximized;
[0005]b. Front and back connecting boards will cause SMT to increase input costs such as line body and manpower;
[0006]c. The thinning of PCB is a great test for the quality of the process, and the quality problems derived include PCB deformation,
[0007] Mounting equipment cannot mount stably, etc.
Method used
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[0019] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0020] see figure 1 and figure 2 , the photoelectric thin plate multiple yin and yang fixture of this embodiment includes a treatment body, the material of the treatment body 1 is aluminum alloy or synthetic stone, T=3-5mm, and the treatment body 1 of the aluminum alloy material is used in this embodiment. After the production is completed, hard oxidation treatment is required.
[0021] A plurality of integrated single boards 2 for integrating PCB boards in the SMT process are spliced on the fixture body 1, and a number of expansion pins 4 for fixing the PCB boards are arranged on the periphery of the integrated single boards 2, which are aligned with the positioning holes at the four corners of the PCB board. Adapt accordingly to ensure that...
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The present invention relates to a photoelectric thin-plate multiple yin-yang jig, which includes a jig body, the jig body is provided with a plurality of integrated veneers for integrating PCB boards in the SMT process, and is provided on the periphery of the integrated veneer for Expansion pins for fixing the PCB board; there are a plurality of orderly arranged windows to be milled on the integrated board, and there are also tracks for transmission on the side of the bottom of the treatment body. The present invention integrates a plurality of SMT manufacturing processes into a single board, that is, changes the traditional single board production method into a multi-connected board or joint board production method, so that SMT can achieve higher equipment, which is convenient to use and improves the small size and high Precision photoelectric thin plate SMT process integration speed and process quality; and by setting the track and expansion pins, the treatment body moves through the slide rail to adapt to the shape of different PCB boards, and has achieved the purpose of fixing the PCB board, avoiding the deformation of the PCB board, Reduce the labor intensity and production cost of workers, and improve the output and production efficiency of enterprises.
Description
technical field [0001] The present invention relates to the SMT process integration of small-sized high-precision photoelectric thin plates, and specifically relates to a small-sized high-precision photoelectric thin-plate multiple yin-yang jig. Background technique [0002] With the trend of miniaturization and high intelligence of electronic products, the SMT process has also entered the period of high precision, high density and small size. When the existing SMT process of PCB board is integrated, it is produced by the traditional single board fixture, which is characterized by the unit The number of dots is small, the front and back are connected, and the thickness of most PCBs is less than 1.0mm. [0003] However, due to the influence of existing product characteristics, there are following defects: [0004] a. The number of unit points is small, and the CT of the SMT wire body will be seriously unbalanced, and the output cannot be maximized; [0005] b. Front and bac...
Claims
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IPC IPC(8): H05K3/30
Inventor 李忠进
Owner 昆山元崧电子科技有限公司