LED (light-emitting diode) packaging structure and manufacturing method thereof

Abstract

The invention discloses an LED packaging structure. The LED packaging structure adopts an LED device module structure, so that a series of packaging processes such as separate scribing and wiring are not required for each LED chip unit, which saves the process and reduces the production cost. ; and the LED module adopts a vertical electrode structure, which can be directly packaged and packaged, which improves the overall performance of the LED; at the same time, it also discloses a preparation method for the LED package structure, which combines the LED module with the vertical electrode structure and the LED drive circuit And the ESD protection circuit is directly fixed on the chip-on-board package bonding pad substrate, thereby improving the overall performance of the LED, and because each LED module includes a plurality of LED chip units, and the plurality of LED chip units pass through the same substrate connection, so that there is no need to perform a series of packaging processes such as dicing and wiring for each LED chip unit, which saves the process and reduces the production cost.

Description

technical field [0001] The invention relates to the technical field of LED preparation, in particular to an LED packaging structure and a preparation method thereof. Background technique [0002] A light-emitting diode (LED, Light Emitting Diode) is a semiconductor solid-state light-emitting device, which uses a semiconductor PN junction as a light-emitting material, and can directly convert electricity into light. When a forward voltage is applied to both ends of the semiconductor PN junction, the minority carriers injected into the PN junction recombine with the majority carriers, releasing excess energy to cause photon emission, and the direct emission colors are red, orange, yellow, Green, blue, blue, purple light. [0003] In 1998, Lumileds packaged the world's first high-power LED (1W LUXOEN type device), which made LED devices change from the previous application of indicator lights to a new type of solid light source that can replace traditional lighting, triggering...

AI Technical Summary

Problems solved by technology

In the current LED chip packaging process, the LED chips must first be diced into individual chip units (die), and then the individual chip units are packaged and connected in series and parallel, which makes the process steps particularly cumbersome. Manufacturing efficiency is lower and manufacturing cost is increased

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