Object processing method and object processing apparatus

Abstract

The invention discloses an object processing method and an object processing device, which can enable the object to conduct a self-splitting. The object processing method comprises the following steps. Laser beam is produced from a laser light source. A divergence angle of laser beam is corrected. The corrected laser beam is focused on objects to form a spot. The shape or size of the spot is controlled with the divergence angle correction of the laser beam. A phase transformation domain is formed inside an object by the spot. The object conducts a self-splitting with a phase change area as a starting point.

Description

technical field [0001] The present disclosure relates to a target object processing method and a target object processing device, in particular, to a target object processing method and a target object processing device for self-breaking the target object by using a laser beam. Background technique [0002] Recently, with the development of laser technology, a method of scribing or cutting a target object such as a semiconductor substrate or an LED substrate with a laser beam has been used to divide the target object into a plurality of chips. Generally, in a scribing method using a laser beam, a scribing line is first formed on the substrate along a preset cutting line by irradiating a laser beam onto the surface of the substrate, and then by physically acting on the substrate. or thermal influence to split the substrate. [0003] However, in the conventional method, when the substrate is cut, fine dust is generated to adversely affect the characteristics of the elements o...

AI Technical Summary

Problems solved by technology

Specifically, a laser beam has its own divergence angle, and divergence angles vary even when the same kind of laser beam source is used, so it is difficult to form a spot suitable for processing the inside of a substrate with a conventional laser beam delivery system

[0005] In addition, in the above conventional method, a separate cutting process is required after the dicing process

During this dicing process, considerable external force needs to be applied to the substrate, which increases the number of processing times and processing time and leads to an increase in cost

Furthermore, if the dicing process is not performed accurately, the substrate can be cracked in an undesired direction or the cut face can be defective during dicing

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