Capacitance microphone chip

A technology of condenser microphones and chips, which is applied in the direction of electrostatic transducer microphones, diaphragm structures, etc., can solve problems affecting the reliability of condenser microphones, etc.

Active Publication Date: 2011-11-16
WEIFANG GOERTEK MICROELECTRONICS CO LTD
View PDF4 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the condenser microphone with existing structure, if the chip size is simply reduced, its sensitivity will be reduced accordingly. If a condenser microphone with a corrugated membrane structure is used, this structure ca

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Capacitance microphone chip
  • Capacitance microphone chip
  • Capacitance microphone chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be further described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0017] figure 1 , figure 2 and image 3 Respectively represent the top view of the condenser microphone chip of the embodiment of the present invention, figure 1 A section along the dashed line A-A of and figure 2 A top view along the dotted line B-B. Such as Figure 1 ~ Figure 3 As shown, the capacitive microphone chip provided by the present invention includes, from bottom to top, a substrate 21 with a through hole, a diaphragm supporting layer 31 disposed above the substrate corresponding to the substrate 21, and a through hole covering the diaphragm supporting layer 31. The upper diaphragm 32, the back pole support layer 36 (also a sacrificial layer) with a through hole corresponding to the through hole of the substrate 21 above the diaphragm 32, and the back pole 22 disposed above the back pole support layer 36 .

[001...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a capacitance microphone chip which comprises a substrate with a through hole, a diaphragm support layer arranged at the upper part of the substrate and corresponding to the substrate, a diaphragm covered at the upper part of the diaphragm support layer, a back electrode support layer arranged at the upper part of the diaphragm and a back electrode arranged at the upper part of the back electrode support layer, wherein a circular vein membrane which is concentric with the diaphragm is arranged in the edge region of the diaphragm. In the capacitance microphone chip provided by the invention, the vein membrane and reinforcing rib structure of the invention can be used for effectively enhancing the vibration amplitude of the diaphragm, thereby enhancing the change of the capacitance in the chip to further improve the sensitivity of a capacitance microphone on the premise that the volume of the chip is not changed; the part, provided with a diaphragm reinforcing rib, in the vein membrane on the diaphragm is basically maintained to perform translational motion and the capacitance change rate of the microphone is improved; the problem that the local deformation of the diaphragm is overlarge is avoided; and the sensitivity and reliability of the capacitance microphone chip are improved.

Description

technical field [0001] The invention relates to the technical field of condenser microphones, in particular to a condenser microphone chip manufactured by MEMS technology. Background technique [0002] In recent years, capacitive microphones made of MEMS technology have been more and more widely used in audio equipment such as mobile phone communications due to their good stability, reliability, shock resistance, and frequency characteristics. With the development of applications, the requirements for condenser microphones are further increased, requiring smaller size and higher sensitivity. In the condenser microphone with existing structure, if the chip size is simply reduced, its sensitivity will be reduced accordingly. If a condenser microphone with a corrugated membrane structure is used, this structure can significantly improve the sensitivity of the condenser microphone, but in When working, the diaphragm deforms too much locally due to the influence of stress, which...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H04R19/04H04R7/02
Inventor 隋鸿鹏潘昕宋青林
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap