Iron-containing fixed abrasive grinding and polishing pad
A technology of consolidating abrasives and polishing pads, which is applied in abrasives, metal processing equipment, manufacturing tools, etc., can solve the problems of affecting the processing surface shape accuracy, insufficient rigidity of grinding and polishing pads, and reducing processing efficiency, so as to improve surface shape accuracy, Avoid downtime for dressing polishing pads and improve processing efficiency
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Embodiment 1
[0019] Example 1: An iron-containing consolidated abrasive grinding and polishing pad, which is formed by uniformly mixing and curing abrasives, iron powder and resin, and its preparation method is the same as that of the existing polishing pad, wherein 400g of silicon carbide abrasive, 150g of atomized iron powder, and 450g of resin (Can adopt the exact same resin that uses with existing polishing pad, as hydrophilic resin, also can adopt the applicant's application number that is 2007100248219, 2008102440960, 2008100227414, 2009102135958, 201010145260X the resin formula used in to realize, the same below). The key point of the present invention is that iron powder is added to the polishing pad, and the remaining components are basically the same as the prior art except for the ratio relationship. The silicon carbide has a particle size of 50 microns and the atomized iron powder has a particle size of 20 microns. Made into grinding and polishing pads, the surface shape of K...
Embodiment 2
[0020] Example 2: An iron-containing fixed abrasive grinding and polishing pad is formed by uniformly mixing and curing abrasives, iron powder and resin. Its preparation method is the same as that of the existing polishing pad, wherein 200g of cerium oxide abrasive, 250g of electrolytic iron powder, and 550g of resin. The key point of the present invention is that iron powder is added to the polishing pad, and the remaining components are basically the same as the prior art except for the ratio relationship. The particle size of the cerium oxide is 10 microns, and the particle size of the electrolytic iron powder is 10 microns. The surface shape of K9 glass made of grinding and polishing pad is increased by 180%, the material removal rate is increased by 230%, and the self-repairing ability is increased by 55 times. Grinding and polishing monocrystalline silicon wafers, the surface shape is improved by 50%, the material removal rate is increased by 150%, and the self-repairi...
Embodiment 3
[0021] Example 3: An iron-containing fixed abrasive grinding and polishing pad, which is formed by uniformly mixing and curing abrasives, iron powder and resin, and its preparation method is the same as that of the existing polishing pads. The specific composition is 350g of diamond abrasive, 150g of hydroxyl iron powder, and 500g of resin . The key point of the present invention is that iron powder is added to the polishing pad, and the remaining components are basically the same as the prior art except for the ratio relationship. The particle size of the diamond is 40 microns, and the particle size of the hydroxyl iron powder is 20 microns. The surface shape of K9 glass made of grinding and polishing pad is increased by 140%, the material removal rate is increased by 28%, and the self-repairing ability is increased by 50 times. Grinding and polishing monocrystalline silicon wafers, the surface shape is increased by 80%, the material removal rate is increased by 350%, and ...
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