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epoxy resin composition

A technology of epoxy resin and epoxy compound, which is applied in the direction of epoxy resin glue, polyether adhesive, adhesive type, etc., can solve the problems of not being able to obtain light intensity, not being able to emit, etc.

Inactive Publication Date: 2011-12-14
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the sealing adhesive of the conventional art is not adequate in terms of moisture permeability, and in addition, the cured product of the sealing adhesive is stained in many cases
Therefore, in the case of a light emitting device that extracts light through a sealing adhesive, such as an organic EL device having a top emission structure (a structure in which light is extracted from the top side opposite to the bottom side on which the electronic circuit is mounted), cannot emit the desired color light and sometimes cannot get enough light intensity

Method used

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Embodiment Construction

[0033] Preferred embodiments of the invention have been described.

[0034] As described above, the epoxy resin composition of the present invention is an epoxy resin composition comprising (a) an epoxy compound, and (b) having two or more compounds reactive with the epoxy compound. A crosslinking group compound, wherein the weight ratio of (a) to (b) is 0.3 to 3, and the epoxy resin composition has, for example, a refractive index of 1.6 or higher.

[0035] In one embodiment, the epoxy resin composition contains a monofunctional epoxy compound having a biphenyl structure as component (a). The monofunctional biphenyl epoxy compound has one epoxy group and at least one biphenyl structure in one molecule. This structure imparts low moisture permeability, high refractive index, and flexibility to the composition and contributes to the reduction of the viscosity of the composition, compared with conventionally used multifunctional biphenyl epoxy resins. Epoxy groups (eg, glycidy...

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Abstract

The invention discloses an epoxy resin composition, which has low moisture permeability, transparency and high refractive index. The epoxy resin composition includes an epoxy compound, and a compound having two or more crosslinking groups reactive with the epoxy compound. The weight ratio of (a) to (b) is 0.3 to 3, and the epoxy resin composition has a refractive index of 1.6 or higher.

Description

technical field [0001] The present invention relates to epoxy resin compositions having low moisture permeability. Background technique [0002] In general, electronic devices are susceptible to moisture, which can be seen in short circuits or electrode corrosion due to moisture condensation or in dimensional changes or degradation of materials due to moisture absorption. Therefore, in order to allow the device to operate for a long time, the device is usually sealed by using a material with low moisture permeability. [0003] For example, also in the case of preventing leakage of liquid components such as electrolyte solutions or liquid crystals of lithium ion batteries or liquid crystal devices, low moisture permeability resin materials are used not only to prevent slight leakage but also to reduce penetration or intrusion The effect of moisture on the material. [0004] In particular, organic EL devices are extremely susceptible to moisture compared to other electronic ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/18H05B33/14
CPCH01L23/293H05B33/04C08L63/00C09J163/00C08L2203/02C08G59/223C08K5/0025C08G59/68C08K5/06C08G65/329H01L2924/12044C09J171/02H01L2924/0002H01L2924/00C08G59/18H05B33/14
Inventor 藤田淳
Owner 3M INNOVATIVE PROPERTIES CO