Evaporation device, thin film deposition device and method for supplying raw materials to the device

A thin film deposition device and evaporation technology, which is applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of reduced production volume and productivity, and the inability to continuously execute manufacturing processes, etc.

Inactive Publication Date: 2011-12-14
SNU PRECISION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the manufacturing process cannot be performed continuously, and after several deposition processes, the entire unit should be shut down
As a result, production volume and productivity decrease

Method used

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  • Evaporation device, thin film deposition device and method for supplying raw materials to the device
  • Evaporation device, thin film deposition device and method for supplying raw materials to the device
  • Evaporation device, thin film deposition device and method for supplying raw materials to the device

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Embodiment Construction

[0043] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention may also be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0044] In the drawings, the dimensions of various layers and regions are exaggerated for convenience of illustration. Throughout the drawings, the same reference numerals refer to the same components.

[0045] figure 1 is a cross-sectional view of a thin film deposition device according to an embodiment of the present invention; figure 2 to cut vertically through figure 1 A conceptual diagram of the thin film deposition apparatus obtained from a cross section of the thin film deposition apparatus shown; image 3 is a conceptual...

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PUM

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Abstract

Provided are an evaporation apparatus and a thin film depositing apparatus, and a source material filling method thereof. The thin film depositing apparatus includes a chamber having an inner space, a substrate transferring member to fix a substrate and move the substrate within the inner space, and a plurality of evaporation members to supply a deposition source material to the substrate, wherein each of the evaporation members is disposed to allow its central extension line to form an acute angle with a surface of the substrate that moves. Therefore, it is possible to form a thin film on the substrate by supplying the vaporized source material to the substrate in a sloped direction with respect to the substrate through the use of the plurality of evaporation members, and to fill the source material by selectively control only an evaporation member where the source material is exhausted without shutting down the whole apparatus.

Description

technical field [0001] The present invention relates to an evaporation device, a thin film deposition device and a method of providing raw materials to the device, more specifically, to a method capable of depositing a uniform thin film on a vertically erected device by utilizing several evaporation components. A method of supplying a source material to an evaporation component (ie, an evaporation device) in which the source material is exhausted on a substrate in a state of movement without shutting down the entire device. Background technique [0002] In the past, sputtering and evaporation methods have been used to form an aluminum (Al) layer on an insulating substrate (eg, a glass substrate). In sputtering, ions or neutral particles strike a target, causing atoms to be ejected. The emitted atoms adhere to the substrate to form a layer. However, when manufacturing an organic light emitting device (OLED), plasma generated during a sputtering process may significantly dam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/203
CPCC23C14/24C23C14/044C23C14/246
Inventor 尹亨硕孙成官姜敞晧权铉九
Owner SNU PRECISION CO LTD
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