Device for automatically detecting flatness and thickness of substrates and separating substrates

Abstract

The invention discloses a device for automatically detecting the flatness and thickness of substrates and separating the substrates. The device comprises a base, a working table, a substrate supporting table, a substrate box mechanism, a mechanical hand, a computer control system, a laser scanner and substrate separation boxes, wherein the mechanical hand consists of an upper substrate arm and a lower substrate arm; the computer control system controls the upper substrate arm of the mechanical hand to be absorbed to the substrates in the substrate box mechanism and moves the substrates to the substrate supporting table; the computer control system controls the laser scanner to scan the substrates which are placed on the substrate supporting table and classifies substrate data which is obtained by scanning; and after scanning is finished, the computer control system controls the movement direction and angle of the lower substrate arm of the mechanical hand according to data classification, and the lower substrate arm is absorbed to the substrates on the substrate supporting table, moves the substrates and places the substrates into the corresponding substrate separation boxes. The device has the advantages that: parameters of the substrates are detected in real time in an on-line mode; the substrates are separated and classified according to a detection result; and the whole value of a product is improved, and production cost is reduced.

Description

technical field [0001] The invention relates to a detection and sorting device for a semiconductor substrate, in particular to a device for automatically detecting the flatness and thickness of a substrate and sorting the substrate. Background technique [0002] In the process of integrated circuit manufacturing, LED production and solar cell chip production, by sorting substrates with different thickness and flatness, the substrates that meet the requirements can be directly applied to the production of products. Therefore, the detection accuracy and sorting of substrates directly affect the accuracy and quality of products. [0003] At present, the usual practice in China is to conduct relevant sampling inspections on the substrates manually, and then sort the substrates manually, which not only leads to low efficiency and detection accuracy, but also pollutes the substrates, which is not conducive to Subsequent production. Contents of the invention [0004] The purpos...

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Problems solved by technology

[0003] At present, the usual practice in China is to conduct relevant sampling inspections on the substrates manually, and then sort the substrates manually, which not only leads to low efficiency and detection accuracy, but also pollutes the substrates, which is not conducive to Subsequent production

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