integrated circuit assembly method

Abstract

The invention discloses a method for assembling an integrated circuit, which includes the steps of plastic sealing, curing after plastic sealing, deburring, and electroplating. The invention can maintain the original reliability of the packaging resin, and effectively and conveniently remove the defects on the surface and side of the lead frame during the plastic sealing process. The overflow, and can reduce the delamination of the internal interface, so that the product performance is reliable.

Description

Technical field: [0001] The invention relates to a method for assembling an integrated circuit. Background technique: [0002] At present, in all integrated circuit post-packaging industries in the world, the PMC process (post-curing process after plastic sealing) is placed after the plastic sealing process and before the deflashing plating process. Its purpose is to fully guarantee the integrity of the packaging resin itself Reliable performance, in order to effectively protect the function of the internal chip circuit. However, this traditional packaging process has its disadvantages: on the one hand, the strength of the packaging resin will increase after plastic sealing and curing (PMC), which increases the difficulty of removing the flash in the post-process. If it is not clean, there will be exposed copper after electroplating, which will lead to the scrapping of the product. If the flash is not clean, it can be removed by manual rework, but it will cost a lot of man...

AI Technical Summary

Problems solved by technology

However, this traditional packaging process has its disadvantages: on the one hand, the strength of the packaging resin will increase after plastic sealing and curing (PMC), which increases the difficulty of removing the flash in the post-process. If it is not clean, there will be exposed copper after electroplating, which will lead to the scrapping of the product

If the flash is not clean, it can be removed by manual rework, but it will cost a lot of manpower, increase the manufacturing cost, prolong the manufacturing cycle of the product, and may cause the possibility of artificially damaging the appearance of the product; On the one hand, during the post-curing (PMC) process after plastic sealing, due to the curing shrinkage stress of the packaging resin and the thermal shock of the post-curing temperature on the product, the stress between the internal interfaces will be increased to a certain extent or the internal interfaces will be damaged. The bonding between the internal interfaces, once there is a large stress between the internal interfaces or the bonding between the interfaces is damaged, it will aggravate the damage of the internal interfaces in the subsequent deburring process, especially during the electrolysis process, resulting in delamination between the interfaces Or the adhesive force is greatly reduced, thereby reducing the product's moisture absorption evaluation level and its reliability