The embodiment of the invention discloses a double-side polishing device and method capable of controlling the rigidity of a polishing pad through a cluster dynamic magnetic field. The whole process from rough polishing to fine polishing of both sides of a workpiece is achieved by adjusting the rigidity of the flexible polishing pad, and the problem that in the traditional machining process, machining of the workpiece is nonuniform due to the fact that the relative speed between different positions of the workpiece and the polishing pad is inconsistent is solved. The double-side polishing device capable of controlling the rigidity of the polishing pad through the cluster dynamic magnetic field comprises a variable-rigidity cluster magnetic-control polishing pad generating mechanism, a workpiece fast clamping mechanism and a workpiece movement driving mechanism, wherein the variable-rigidity cluster magnetic-control polishing pad generating mechanism comprises a first magnetic field generating block and a second magnetic field generating block which are arranged symmetrically; the first magnetic field generating block and the second magnetic field generating block each comprise a shell, a deflection spindle, an eccentric camshaft, a magnetic mounting seat, permanent magnets and a motor; the workpiece fast clamping mechanism comprises a working slot, a clamping plate, a connecting rod, a hinge plate, a fixed hinge, a square magnet, an electrical soft iron block, annular cast iron and a strip-shaped permanent magnet; and the workpiece movement driving mechanism comprises a supporting block, a crossbeam, a horizontal linear motor, a vertical beam and a vertical linear motor.