The application discloses a kind of selected area
epitaxy GaN-on-Si HEMT direct drive single-
chip integration method, belong to
semiconductor device technical field.The specific inclusion includes: selecting
silicon substrate and dividing GaN device area and
silicon MOSFET device area;
Etching recess window in GaN device area, utilize selected area
epitaxy technology and grow GaN HEMT epitaxial structure in recess window;Subsequently,
silicon MOSFET device and GaN MIS-HEMT device are prepared in corresponding area respectively;Finally, the drain
electrode of silicon
MOSFET device and the source
electrode of GaN MIS-HEMT device are connected by on-
chip metal interconnection process.The application realizes normally
open type GaN MIS-HEMT and normally off type silicon MOSFET monolithic
cascade integration, shortens the device spacing to micron level, greatly reduces parasitic
inductance and
capacitance, effectively suppresses switch oscillation and overshoot, reduces switch loss, and the gate of GaN MIS-HEMT device is independently extracted to realize direct drive, avoiding
reverse recovery charge loss;The method of the application does not need to be bonded, and the process compatibility is good, which significantly improves the high-frequency characteristics, reliability and integration of high-performance power electronic devices.