Assembled radiating fin with transistor

A transistor and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of limited heat dissipation, susceptibility to static electricity, affecting service life, etc., and achieves simple structure and good breakdown resistance. , good heat dissipation effect

Inactive Publication Date: 2012-01-04
KUNSHAN JINTAI ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The common heat dissipation method is to install a heat sink on the circuit board, and install the electronic components that require key heat dissipation on the heat sink, quickly absorb the heat of the circuit board and electronic components through the heat sink, and transfer the heat out through its heat dissipation sur

Method used

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  • Assembled radiating fin with transistor
  • Assembled radiating fin with transistor
  • Assembled radiating fin with transistor

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Experimental program
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Embodiment Construction

[0012] The present invention will be further described below in conjunction with the accompanying drawings.

[0013] like figure 1 , figure 2 As shown, the main body of the heat sink is composed of a copper heat dissipation surface 1 and an aluminum close-fitting surface 2, and the aluminum close-fitting surface 2 is provided with fixing screw holes 3, which are connected to the aluminum close-fitting surface 2 by screws. Fix the screw hole 3 and the connecting screw hole reserved on the circuit board, connect the aluminum close-fitting surface 2 to the circuit board, the copper heat dissipation surface 1 is stacked on top of the aluminum close-fitting surface 2, and the copper A semiconductor triode 4 is provided on the heat dissipation surface 1, and the semiconductor triode 4 is connected to the mounting screw hole 6 on the copper heat dissipation surface 1 through a screw 5. The surface of the semiconductor triode 4 is provided with an insulating silica gel protective la...

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PUM

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Abstract

The invention discloses an assembled radiating fin with a transistor. The radiating fin comprises a radiating fin main body and a transistor. The radiating fin is characterized in that: the radiating fin main body is composed of a heat radiation surface and a clinging surface; the heat radiation surface is superposed on the clinging surface in transplacement and is provided with a screw hole that is used for fixing the transistor; the transistor is fixed above the heat radiation surface; the clinging surface is provided with a fixed screw hole and a surface of the transistor is provided with an insulating silica gel protective layer. According to the invention, the assembled radiating fin is mainly used for auxiliary heat radiation for a circuit board; and the assembled radiating fin has advantages of simple structure, good anti-breakthrough performance and good heat radiation effect for a transistor.

Description

technical field [0001] The invention belongs to the field of circuit board heat dissipation, in particular to an assembled heat dissipation sheet with a semiconductor triode. Background technique [0002] Due to the integration of a large number of electronic components on the circuit board, a large amount of heat will be released during operation, causing the temperature of the circuit board to rise. If the temperature in a local area is too high, it will affect the working stability of the electronic components. Therefore, it is necessary to improve the heat dissipation effect of the circuit board and reduce the working temperature. temperature, to ensure its stability and prolong its service life. [0003] The common heat dissipation method is to install a heat sink on the circuit board, and install the electronic components that require key heat dissipation on the heat sink, quickly absorb the heat of the circuit board and electronic components through the heat sink, and...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/373H01L23/29H01L23/40
Inventor 陈泉留
Owner KUNSHAN JINTAI ELECTRONICS EQUIP
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