Method for optimizing integrated circuit layout heat distribution

An integrated circuit and heat distribution technology, applied in the fields of electrical digital data processing, instruments, calculations, etc., can solve the problems of reducing hot spot distribution, not being able to effectively optimize the thermal distribution of the physical layout of integrated circuits, and reducing the temperature of hot spots, so as to reduce the distribution of hot spots , reduce temperature, improve work performance and reliability

Active Publication Date: 2012-01-11
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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AI Technical Summary

Problems solved by technology

From the perspective of integrated circuit design process, it is not enough to consider thermal optimization only in the stage of layout planning and device layout, and it cannot effectively optimize the thermal distribution on the physical layout of integrated circuits, reduce the distribution of hot spots and reduce the temperature of hot spots

Method used

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  • Method for optimizing integrated circuit layout heat distribution
  • Method for optimizing integrated circuit layout heat distribution
  • Method for optimizing integrated circuit layout heat distribution

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Embodiment Construction

[0039] with Si and SiO 2 Compared to metals, which have high thermal conductivity, metal graphics can have high thermal conductivity. After the integrated circuit wiring is completed, the heat conduction path can be adjusted by inserting dummy metal pattern wiring to optimize the heat flow path to realize re-optimization of heat distribution.

[0040] The invention proposes an automatic optimization method aimed at the physical layout design of integrated circuits, based on computer aids, optimizing the thermal distribution of integrated circuit layouts through metal filling, and aiming at improving the working performance of integrated circuits. The method includes: receiving data such as circuit netlist, circuit simulation results, physical layout of the circuit, and physical design rules of the circuit as input; determining key devices and key nets in the circuit through circuit analysis; Set filling barriers around the physical connection; determine the key hot spots on t...

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Abstract

The invention relates to a method for optimizing integrated circuit layout heat distribution, which belongs to the field of integrated circuit design automation. The method comprises the following steps of: inputting a circuit netlist, a circuit simulation result, a physical layout of a circuit and a physical design rule of the circuit; performing circuit analysis to determine a key apparatus anda key net in the circuit; setting a filling barrier on the physical layout of the circuit according to the physical design rule of the circuit; performing heat analysis to determine a key heat point on the physical layout of the circuit; adding a heat-conduction passage for the key heat point, filling dumb metal patterns on a metal layer according to the heat-conduction passage and the physical design rule of the circuit, and additionally forming dumb metal through holes according to the heat-conduction passage and the physical design rule so as to connect the dumb metal patterns on the heat-conduction passage until the physical layout heat distribution of the circuit cannot be optimized through new dumb metal filling; and outputting the filled metal patterns to a physical layout database. The heat distribution of the integrated circuit physical layout can be effectively optimized through dumb metal filling.

Description

technical field [0001] The invention relates to the field of integrated circuit design automation, in particular to a method for optimizing heat distribution of an integrated circuit layout. Background technique [0002] In integrated circuit design, the characteristics of devices are very sensitive to temperature. Changes in temperature will cause obvious changes in device characteristics, which in turn will lead to obvious changes in upper circuit performance and even changes in circuit functions. Therefore, determining a reasonable temperature distribution is crucial to ensure all It is critical that the designed circuit work properly. There are two main ways to determine a reasonable temperature distribution, one is to optimize the distribution of heat sources, and the other is to optimize the heat flow path. [0003] In the existing integrated circuit design process, the optimization of thermal distribution is mainly considered and realized in the stage of physical lay...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 吴玉平陈岚叶甜春
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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