Apparatus and method for manufacturing laminated electronic component
A technology for electronic components and manufacturing devices, which is applied in the fields of capacitor manufacturing, semiconductor/solid-state device manufacturing, inductor/transformer/magnet manufacturing, etc., and can solve the problems of increased energy consumption such as power, heavy suction roller weight, stacking position deviation, etc. problem, to achieve the effect of reducing the transmission positioning deviation, increasing the production line speed, and reducing the device
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0032] The multilayer electronic component manufacturing apparatus and the multilayer electronic component manufacturing method according to the first embodiment of the present invention will be described with reference to the drawings. In addition, multilayer electronic components such as multilayer ceramic capacitors and multilayer ceramic inductors are included in the "multilayer electronic component" which is the object of manufacture of the present invention. Next, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component.
[0033] First, a multilayer electronic component manufacturing apparatus will be described.
[0034] In addition, in the first embodiment, the elongated ceramic sheet on which the electrode circuit (internal electrode) and the dielectric coating film have been formed is continuously (non-intermittently) conveyed by a sheet conveying roller described below.
[0035] Such as figure 1 As shown, the laminated ele...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com