Flexible circuit board and manufacture method thereof

A technology of flexible circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., and can solve the problems that the electromagnetic wave protective film is difficult to achieve the expected electromagnetic shielding effect and the flexible circuit board has high requirements for the manufacturing process.

Inactive Publication Date: 2012-01-11
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, attaching the electromagnetic wave protection film has higher requirements on the manufacturing process of the flexible circuit board.
Lamination of different types of electromagnetic wave protective film The temperature, pressure and other parameters of the protective film are directly rel

Method used

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  • Flexible circuit board and manufacture method thereof
  • Flexible circuit board and manufacture method thereof
  • Flexible circuit board and manufacture method thereof

Examples

Experimental program
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Embodiment Construction

[0043] The flexible circuit board provided by the technical solution and its manufacturing method will be further described in detail below in conjunction with the accompanying drawings and multiple embodiments.

[0044] see figure 1 , The first embodiment of the technical solution provides a flexible circuit board 100 , which includes an insulating layer 11 , a conductive pattern 120 , a covering layer 130 and a metal sputtering layer 140 . The flexible circuit board 100 may include a plurality of flexible circuit board units 15 arranged in sequence.

[0045] The insulating layer 11 can be a polyester (PET) film or a polyimide (PI) film.

[0046] The conductive pattern 120 is formed on the insulating layer 11 . The conductive pattern 120 is made of copper, and includes a ground wire 121 and a signal transmission wire 122 . In this embodiment, the ground wire 121 and the signal transmission wire 122 are both long strips and arranged side by side. Each ground wire 121 has a...

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Abstract

The invention relates to a flexible circuit board, which comprises an insulation layer, a conduction pattern, a covering layer and a continuous metal sputtering plating layer, wherein the conduction pattern is formed on the insulation layer, the covering layer is covered on the conduction pattern, the conduction pattern comprises a grounding wire and a signal transmission wire, the covering layer is provided with a through hole used for exposing at least a part of grounding wire, and the metal sputtering plating layer is formed on the surface of the covering layer far away from the conduction pattern, the hole wall of the through hole and the surface of the grounding wire exposed out of the through hole through sputtering plating, so the metal sputtering plating layer is electrically connected with the grounding wire. The technical scheme also provides a manufacture method of the flexible circuit board. The flexible circuit board has good electromagnetic shielding performance.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a flexible circuit board and a manufacturing method thereof. Background technique [0002] With the continuous development of foldable electronic products such as folding mobile phones and slider mobile phones, flexible printed circuit boards (Flexible Printed Circuit Board, FPCB) with light, thin, short, small and bendable characteristics are widely used in electronic products. To realize the electrical connection between different circuits. With the increasingly powerful functions of consumer electronic products, the improvement of electromagnetic shielding performance of flexible circuit boards has become one of the important topics in the field of circuit board technology research. [0003] The flexible circuit board usually forms a cover layer for protecting the conductive pattern on the side of the conductive pattern away from the insulating layer. A commonly used ...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11H05K3/16H05K9/00
Inventor 郑建邦
Owner AVARY HLDG (SHENZHEN) CO LTD
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