Flexible circuit board and manufacture method thereof

Abstract

The invention relates to a flexible circuit board, which comprises an insulation layer, a conduction pattern, a covering layer and a continuous metal sputtering plating layer, wherein the conduction pattern is formed on the insulation layer, the covering layer is covered on the conduction pattern, the conduction pattern comprises a grounding wire and a signal transmission wire, the covering layer is provided with a through hole used for exposing at least a part of grounding wire, and the metal sputtering plating layer is formed on the surface of the covering layer far away from the conduction pattern, the hole wall of the through hole and the surface of the grounding wire exposed out of the through hole through sputtering plating, so the metal sputtering plating layer is electrically connected with the grounding wire. The technical scheme also provides a manufacture method of the flexible circuit board. The flexible circuit board has good electromagnetic shielding performance.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a flexible circuit board and a manufacturing method thereof. Background technique [0002] With the continuous development of foldable electronic products such as folding mobile phones and slider mobile phones, flexible printed circuit boards (Flexible Printed Circuit Board, FPCB) with light, thin, short, small and bendable characteristics are widely used in electronic products. To realize the electrical connection between different circuits. With the increasingly powerful functions of consumer electronic products, the improvement of electromagnetic shielding performance of flexible circuit boards has become one of the important topics in the field of circuit board technology research. [0003] The flexible circuit board usually forms a cover layer for protecting the conductive pattern on the side of the conductive pattern away from the insulating layer. A commonly used ...

AI Technical Summary

Problems solved by technology

However, attaching the electromagnetic wave protection film has higher requirements on the manufacturing process of the flexible circuit board.

Lamination of different types of electromagnetic wave protective film The temperature, pressure and other parameters of the protective film are directly related to the rupture of the conductive particles of the conductive adhesive layer and the contact area between the ground wire. If the lamination parameters are not properly controlled, the electromagnetic wave The protective film is difficult to achieve the expected electromagnetic shielding effect

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