Aluminum ribbon for ultrasonic bonding

A technology of ultrasonic welding and aluminum strip, which is applied in transportation and packaging, electric solid devices, semiconductor devices, etc., and can solve problems such as unmaintainable joint conditions and poor connections

Inactive Publication Date: 2012-01-18
TANAKA DENSHI KOGYO KK
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] However, in the case of aluminum strips used to connect semiconductor devices by ultrasonic welding, although the joining conditions using ultrasonic waves are different between the front surface and the rear surface, ultrasonic welding is automatically performed at a rate of several per second, so it is necessary to Even tens of thousands of times

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Aluminum ribbon for ultrasonic bonding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0078] Embodiments of the present invention are described below.

[0079] Starting from the alloy composition shown in Table 1 (aluminum (Al) with a purity of 99.999% by mass was used as the raw material, but the same result was obtained for aluminum (Al) with a purity of 99.99% by mass) and a welding wire with a specified wire diameter. Materials, Examples 1-20 and Comparative Examples 1-5 shown in Table 1 were prepared.

[0080] Next, using a rolling device (not shown), these aluminum strips are subjected to a one-stage hot rolling process to make the surface roughness R Z = 0.5 micrometers (μm), the average grain size was 10 micrometers (μm), the thickness was 120 micrometers (μm), and the aspect ratio of width / thickness was 11. Next, these aluminum strips were washed twice with hot pure water at 80°C. Subsequently, at room temperature, with the linear speed of 80 m / min, the aluminum strip of regulation is in the 5000 times pure water dilution solution (A liquid) of non-i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Provided is an aluminum ribbon for ultrasonic bonding which, even when used for bonding tens of thousands of times, can retain high bond strength and a certain level of bond strength. The aluminum ribbon for ultrasonic bonding comprises aluminum metal or an aluminum-based alloy, the aluminum having a purity of 99.99 mass% or higher. The aluminum ribbon has a nonionic surfactant having a molecular weight of 500 or less, the surfactant having been deposited through vaporization to dryness on a mirror surface of the ribbon in an amount of 100-1,000 [mu]g/m2 in terms of total organic-carbon amount.

Description

technical field [0001] The present invention relates to an aluminum strip used for connecting semiconductor element electrodes and lead portions on the substrate side by ultrasonic welding in electronic components and semiconductor packages. Background technique [0002] In the manufacture of semiconductor devices, it is widely used to electrically connect the connection electrodes (pads) provided on the semiconductor chip and the external terminals (leads) provided in the semiconductor package, and use strip-shaped aluminum conductors with a nearly rectangular cross section. Body (hereinafter referred to as "strip") welding method. This welding method utilizes a welding method of aluminum conductive wires, in which a cemented carbide tool is pressed against an aluminum strip overlaid on an electrode or a lead, and the load and the energy of ultrasonic vibration are applied to perform bonding. [0003] The effect of applying ultrasonic waves is as follows, through the expan...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/60H01L21/607
CPCH01L2224/45014H01L2924/01006H01L2224/43H01L2924/01003H01L2924/01049H01L2924/01004H01L2924/01015H01L2924/01204H01L2224/85205H01L2924/01082H01L2924/01038H01L2924/01012H01L2924/0106H01L2924/01027H01L2924/00014H01L2924/01057H01L2924/01005H01L2924/01033H01L24/45H01L2924/01019H01L2924/01079H01L2924/01083H01L2224/45144H01L2924/0102H01L2924/01013C22C21/00H01L24/43H01L2924/01014H01L2924/01029H01L2224/45124H01L2924/01009H01L2924/01058H01L2924/01028H01L2224/45015H01L2224/43848Y10T428/31678H01L2924/01205H01L2924/00012H01L2924/00H01L2924/013H01L2924/00013H01L2924/01039H01L2224/48H01L2924/00015H01L2924/206
Inventor 三上道孝菊地照夫中岛伸一郎平田勇一中村政晴木村启裕
Owner TANAKA DENSHI KOGYO KK
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap