Process method for preplating nickel on surface of minuteness aluminum wire before copper plating

A process method and pre-nickel plating technology are applied in the field of pre-nickel plating before copper plating on the surface of fine aluminum wire, which can solve the problems of missing copper plating, affecting the quality of copper plating, and black spots on the surface of copper plating layer.

Inactive Publication Date: 2012-01-25
SHENYANG AIRCRAFT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Only pretreatment is carried out before copper plating of fine aluminum wires, and no pre-nickel plating is carried out, then there will be black...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A process for electroplating copper on the surface of fine aluminum wires. The fine aluminum wires that have been pre-treated are put into the pre-nickel plating solution, and the current density is 1A·dm -2 , The plating temperature is 65°C, and the plating time is 5 minutes; the pre-plating nickel solution is prepared from the following raw materials:

[0014] NiSO 4 ·6H 2 O 100 parts, NiCl 2 ·6H 2 O 20 copies,

[0015] Na 3 C 6 h 5 o 7 2H 2 O 120 parts, (NH 4 ) 2 SO 4 20 copies,

[0016] 10 parts of sodium gluconate, 0.5 parts of saccharin,

[0017] 0.02 part of sodium lauryl sulfate, the above solution is mixed with water according to the ratio of parts by weight, and the pH value is adjusted to 7.0.

Embodiment 2

[0019] A process for electroplating copper on the surface of fine aluminum wires. The fine aluminum wires that have been pre-treated are put into the pre-nickel plating solution, and the current density is 1A·dm -2 , The plating temperature is 65°C, and the plating time is 5 minutes; the pre-plating nickel solution is prepared from the following raw materials:

[0020] NiSO 4 ·6H 2 O 150 parts, NiCl 2 ·6H 2 O 40 copies,

[0021] Na 3 C 6 h 5 o 7 2H 2 O 160 parts, (NH 4 ) 2 SO 4 50 copies,

[0022] 50 parts of sodium gluconate, 1.5 parts of saccharin,

[0023] 0.08 parts of sodium lauryl sulfate, the above solution is mixed with water according to the ratio of parts by weight, and the pH value is adjusted to 7.0.

Embodiment 3

[0025] A process for electroplating copper on the surface of fine aluminum wires. The fine aluminum wires that have been pre-treated are put into the pre-nickel plating solution, and the current density is 1A·dm -2 , The plating temperature is 65°C, and the plating time is 5 minutes; the pre-plating nickel solution is prepared from the following raw materials:

[0026] NiSO 4 ·6H 2 O 120 parts, NiCl 2 ·6H 2 O 30 copies,

[0027] Na 3 C 6 h 5 o 7 2H 2 O 140 parts, (NH 4 ) 2 SO 4 35 copies,

[0028] 30 parts of sodium gluconate, 1.0 parts of saccharin,

[0029] 0.05 part of sodium lauryl sulfate, the above solution is mixed with water according to the ratio of parts by weight, and the pH value is adjusted to 7.0.

[0030] The tests of the above examples prove that the surface of the copper-plated aluminum wire is complete and continuous, the coating is dense and uniform in color, and the defects on the original aluminum wire are also repaired.

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PUM

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Abstract

The invention relates to a process method for electroplating copper on the surface of a minuteness aluminum wire. The process method comprises the following steps of: putting the minuteness aluminum wire which is processed at the front stage into nickel preplating solution, and plating at the temperature of 65 DEG C for 5min by using current at the density of 1A.dm<-2>, wherein the nickel preplating solution is prepared by the following raw materials in part by weight: 100 to 150 parts of NiSO4.6H2O, 20 to 40 parts of NiCl2.6H2O, 120 to 160 parts of Na3C6H5O7.2H2O, 20 to 50 parts of (NH4)2SO4, 10 to 50 parts of sodium gluconate, 0.5 to 1.5 parts of saccharin and 0.02 to 0.08 part of sodium lauryl sulfate; and mixing the solution and water according to weight parts, and adjusting the pH value to be 7.0. By the method, the surface of the aluminum wire which is subjected to nickel preplating and then is subjected to a copper plating process has a smooth and compact surface, fine and tightly-arranged grains and uniform and consistent colors and luster.

Description

technical field [0001] The invention relates to a process method for pre-nickel-plating before copper-plating on the surface of micro-fine aluminum wires, which is used for the pre-nickel-plating process before electro-copper plating on the surface of the micro-fine aluminum wires which has been pre-treated. Background technique [0002] With the rapid development of electronic information technology, metal wires are more and more widely used in various precision instruments, micro electronic control instruments, radios, electronics, etc. As a metal with good electrical conductivity, aluminum is widely used in microelectronics technology. However, aluminum has the disadvantages of being easily oxidized on the surface and extremely difficult to remove the oxide film, which results in high contact resistance and cannot be welded with solder, which seriously affects the quality of aluminum. silk properties. Copper-coated aluminum wire not only has the high-frequency transmissi...

Claims

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Application Information

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IPC IPC(8): C25D5/44
Inventor 乔永莲
Owner SHENYANG AIRCRAFT CORP
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