Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table

A repair station and motherboard technology, applied in the field of repair stations, can solve the problems of long maintenance heating time, high cost, and large footprint of the repair station, and overcome the problems of low maintenance efficiency, high repair yield, and small footprint Effect

Inactive Publication Date: 2012-02-01
HUAQIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Due to the above reasons, in order to complete the maintenance, the temperature setting of the heat gun needs to be very high, reaching 360-390°C, and the heating time for maintenance needs to be very long, 7-10 minutes
[0016] (2) Long-term high-temperature maintenance leads to a large number of waste products
However, using this rework station, the maintenance efficiency is too low, and the maintenance time for a single chip takes 8 to 10 minutes; calculated based on 20 hours of work per day, the daily maintenance capacity of each device is 120 motherboards
Mor...

Method used

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  • Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table
  • Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table

Examples

Experimental program
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specific Embodiment 1

[0062] Specific embodiment one, a method for repairing the motherboard of an AQFN mobile phone.

[0063] The maintenance method described in this embodiment uses the maintenance station described in the second embodiment, and the specific steps are as follows:

[0064] The first step is to adjust the main board fixing table 4, the upper air gun fixing table 5, and the lower air gun fixing table 3 on the maintenance station to the appropriate positions and lock them, and then fix the main board to be repaired, the upper air gun, and the lower air gun respectively on on the respective fixed platforms, so that the upper and lower air guns are respectively aimed at the upper and lower sides of the motherboard to be repaired at the position of the AQFN chip;

[0065] The second step is to set the upper wind gun and the lower wind gun to the appropriate temperature and wind speed level respectively;

[0066] The third step is to turn on the upper and lower air guns at the same time...

specific Embodiment 2

[0075] Specific embodiment two, a maintenance station used in the method for maintaining the motherboard of an AQFN mobile phone.

Embodiment 1

[0076] The maintenance method described in Embodiment 1 requires a dedicated maintenance station.

[0077] The maintenance platform is mainly a mechanical positioning device, including a base 1, a platform column 2, a lower air gun fixing platform 3, a main board fixing platform 4, and an upper air gun fixing platform 5; the platform column 2 is fixed on the middle position of the base 1; The lower air gun fixing platform 3, the main board fixing platform 4, and the upper air gun fixing platform 5 are respectively set on the column 2, and each fixing platform is respectively provided with adjustment and locking structures 31, 41, 51 relative to the column 2. These adjustment and locking fixing structures enable the corresponding fixed platform to adjust the axial height along the platform column and adjust the radial angle around the platform column 2 according to the needs of the maintenance position.

[0078] At the same time, the lower and upper air gun fixing platforms 3 a...

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Abstract

The invention discloses a method for maintaining an AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and a maintenance table. The method comprises the following steps of: 1, fixing the motherboard to be maintained, an upper air gun and a lower air gun on respective fixing tables which are adjusted in place respectively; 2, setting proper temperature and air speed of the upper air gun and the lower air gun respectively; 3, simultaneously starting the upper air gun and the lower air gun for heating and unsoldering; 4, cleaning a bonding pad; 5, smoothly coating a solder wire of the bonding pad; 6, performing chip balling; and 7, simultaneously starting the upper air gun and the lower air gun for heating and reflow soldering. The maintenance table comprises a pedestal 1, a stand 2, a lower air gun fixing table 3, a motherboard fixing table 4 and an upper air gun fixing table 5, wherein the stand 2 is fixed at a middle position of the pedestal 1; the lower air gun fixing table, the motherboard fixing table and the upper air gun fixing table are sleeved on the stand respectively; and each fixing table is provided with an adjusting, locking and fixing structure opposite to the stand. The maintenance method and the maintenance table have the advantages of high maintenance efficiency and low reject ratio; and the maintenance table is low in cost, has small occupied area and is suitable to be arranged on a mobile phone production line.

Description

technical field [0001] The invention relates to a method for repairing the motherboard of an AQFN mobile phone and a repair platform specially used for the repair method. Background technique [0002] QFN (Quad Flat No-lead Package) is a surface-mount chip packaging technology with small pad size, small volume, and plastic as the sealing material. Since the large exposed pad in the center of the bottom is soldered to the heat dissipation pad of the PCB, QFN is relatively incompatible with BGA chip packaging technology (Ball Grid Array Package, that is, ball grid array packaging technology) or TFBGA technology (Thin Fine-Pitch Ball Grid Array) ,), with excellent electrical and thermal properties. [0003] AQFN (Advanced QFN) is an improved QFN packaging technology. Unlike general QFNs, the pins of AQFN protrude, unlike traditional QFNs where the pins are flush with the chip packaging (molding). From the appearance, AQFN and TFBGA are a bit similar, but in actual packaging,...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23K1/012B23K1/20B23K3/00B23K3/08H05K3/34
Inventor 张华
Owner HUAQIN TECH CO LTD
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