Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film

A flat wire and thermosetting adhesive technology, which is applied in the direction of printed circuits connected with non-printed electrical components, assembling printed circuits with electrical components, printed circuits, etc., can solve the problems of inability to mass production, low efficiency and high cost

Active Publication Date: 2012-02-01
TONGLING GUOZHAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the former is costly and polluting, while the latter is too inefficient to be mass-produced

Method used

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  • Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film
  • Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film
  • Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0057] The following will describe in more detail the specific embodiment of the invention in which flat wires bonded and juxtaposed by a thermosetting adhesive film are used to make a single-sided circuit board.

[0058] However, those skilled in the art should understand that the following are only examples and descriptions of some preferred implementations, and other similar or equivalent implementations can also be used to implement the present invention.

[0059] (1) Fabrication of rigid circuit board

[0060] 1. The production of flat wires is made by cutting copper foil into strips, or rolling copper wires with a wire calender, or flat wires 7 with a certain width and thickness (as shown in Figure 2).

[0061] 2. Fabrication of juxtaposition groove molds: process a juxtaposition groove 13 consistent with the width of the line by using a mirror surface stainless steel plate by etching or mechanical processing (such as image 3), the groove depth is shallower than the fl...

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PUM

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Abstract

The invention relates to a single-sided circuit board made by gluing flat wires arranged side by side with a thermosetting adhesive film. Specifically, according to one realization mode of the invention, one group of flat wires arranged side by side are directly glued by a thermosetting adhesive film, parts of the wries, which need to be disconnected are cut off, the surface of the adhesive film is directly combined with a substrate of the circuit board through hot pressing gluing to form a circuit board, soldering resisting ink or a covering film is used for soldering resisting, and bridgingconnection is realized through printing electricity conducting ink or soldering conductors. When a jack element needs to be arranged, soldering installation can be realized as long as a hole is directly drilled in a soldered spot or a hole is punched by a die. The circuit board can be made without etching. Compared with the traditional circuit board making technology, the novel technology has theadvantages of excellent environment friendliness, energy saving and material saving.

Description

technical field [0001] The invention belongs to the circuit board industry. A group of juxtaposed flat wires are directly bonded with a thermosetting adhesive film, the position where the flat wires need to be disconnected is cut off, and the surface of the adhesive film is directly combined with the circuit board base material to form a circuit board. Use solder resist ink or cover film as solder resist, and use printed conductive ink or soldered conductors to connect the bridge connection to make single-sided circuit boards. The invention enables the fabrication of circuit boards without etching. Compared with the traditional method of making circuit boards, the present invention is a very environmentally friendly, energy-saving and material-saving new technology. Background technique [0002] Traditional circuit board wires are usually etched out of copper clad laminates, or laser and milling cutters are used to remove unnecessary copper lines. However, the former are c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/34H05K1/18H05K1/00
CPCF21Y2103/003H05K3/3442H05K3/202H05K3/103F21Y2101/02H05K2203/033H05K3/3447H05K2201/1028H05K2201/10106H05K2203/085F21Y2103/10F21Y2115/10
Inventor 王定锋徐文红
Owner TONGLING GUOZHAN ELECTRONICS
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