Compensation method of modular radiator manufacturing process

Abstract

The invention relates to a compensation method of a modular radiator manufacturing process. The compensation method comprises the following steps: first, sawing an extruded section composed of a single heat storage substrate 1 and a fin 2, and then carrying out sorting and stacking before pressure closing; carrying out primary pressure closing on a plurality of the extruded sections composed of the single heat storage substrate 1 and the fin 2 to generate 2% compressive deformation; carrying out artificial aging treatment on a radiator module obtained from the primary pressure closing at the temperature of 175+/-5 DEG C for 8 hours; then carrying out secondary pressure closing on the radiator module subjected to aging hardening to generate a 1% secondary compressive deformation and obtaina modular radiator; and finally entering a digital control processing center to obtain a finished product. In the invention, on the basis of maintaining a 'modular radiator manufacturing method', thebonding strength level of the 'inner boundary' of the substrate of the radiator is further improved through using a secondary pressure closing process compensation method, thus being capable of obtaining crack defects on the surface of the substrate of the radiator and dye penetrant nondestructive detection zero-defect results.

Description

technical field [0001] The invention relates to a preparation method of an aluminum alloy module radiator, in particular to a compensation method for the manufacturing process of a module radiator composed of single radiator fins obtained by an extrusion method. Background technique [0002] Due to the need for energy saving, the industrialization of frequency conversion technology and frequency converters used in high-power module radiators is in the ascendant. At present, the modular heat sinks used are composed of multiple heat storage substrates and heat sinks with tooth-shaped structures on both sides. Interface", the potential impact on the bonding strength of the overall module heat sink has always been regarded as a structural element that cannot be ignored in the evaluation of thermal problem solutions in the later stage of system structural design. For example, the thermal conductive silicone grease coated on the interface between IGBT electronic components and th...

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Problems solved by technology

The disadvantage is that due to the instability of the bonding strength of the inner interface of the substrate formed after "pressing", the pass rate of the coloring penetration test of the heat sink product is only 50%, resulting in potential risks during the operation of the product.

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