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Aluminium nitride ceramic substrate 50 watts load chip

A technology of aluminum nitride ceramics and aluminum nitride substrates, applied in electrical components, circuits, waveguide devices, etc., can solve the problems of lack of diversified production of customers, centralized size specifications of load chips, and single product selection, etc. Excellent return loss characteristics, enhanced ability to withstand power, and rich specifications

Inactive Publication Date: 2012-02-22
苏州市新诚氏通讯电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Because the aluminum nitride ceramic load sheet is still a new type of industry, there is a relatively concentrated phenomenon of the size and specification of the load sheet, and there is no customer-oriented diversified production, which leads to the general use of higher specification grades in the market to replace lower specification requirements. , for example, when a 50W load chip is required, use the mainstream 100W load chip
At the same time, manufacturing companies generally choose a relatively single size to complete their different designs in terms of substrate size. The disadvantages brought about by this are the relative weakening of the price advantage and the relative singleness of product selection.
At the same time, the design of the customer's product is limited, because the size of the load chip placement is limited. However, with continuous development, customers require the diversity of their own product design, which requires the size and specifications of the load chip to be diversified.

Method used

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  • Aluminium nitride ceramic substrate 50 watts load chip
  • Aluminium nitride ceramic substrate 50 watts load chip

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Embodiment Construction

[0015] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0016] Such as figure 1 As shown, the aluminum nitride ceramic substrate 50-watt load sheet includes a 4*4*1MM aluminum nitride substrate 1, the backside of the aluminum nitride substrate 1 is printed with a back guide layer, and the front side of the aluminum nitride substrate is printed with a wire 2 And several resistors 3, several resistors 3 are connected in parallel through wires 2 to form a load circuit, and the ground terminal of the load circuit is electrically connected to the back conductive layer through silver paste, so that the load circuit can be grounded to form a loop. A pad is provided on the load circuit, and the size of the pad is 0.8*2mm. The back conducting layer and the wire 2 are printed with conductive silver paste, and the resistors are printed with resistive paste. A protective glass film 4 is printed on the resis...

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Abstract

The invention discloses an aluminium nitride ceramic substrate 50 watts load chip which comprises a 4*4*1 mm aluminium nitride substrate. A back side of the aluminium nitride substrate is printed with a back guide layer, and a right side of the aluminium nitride substrate is printed with a lead and a plurality of resistors. The resistors are in parallel connection through the lead to form a load circuit. A grounding terminal of the load circuit is electrically connected with the back guide layer. The load circuit is provided with a pad. According to the load chip, the 4*4*1 mm aluminium nitride substrate is taken as a substrate, parallel resistor design technology instead of traditional single resistor design technology is employed by the load circuit, areas of resistors are effectively increased, power bearing capability of the load chip is reinforced further, simultaneously, by employing the design technology, wiring arrangement of the lead breaks through restriction of an original traditional design, the pad obtains an excellent return loss characteristic while being enlarged, and enlargement of the pad enables convenient and firm welding.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic substrate supporting sheet, in particular to a 50W aluminum nitride ceramic substrate supporting sheet. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. In the actual use of the aluminum nitride ceramic substrate load sheet, it is necessary to have a lead wire welded to the pad of the load sheet. At present, most of the market adopts the design process of small pads, because the enlargement of the pad will directly affect the quality of the product. The return loss increases the return loss, but if a small pad is used, the convenience of welding and the firmness of welding will be adversely affected. [0003] Because the aluminum nitride ceram...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/22
Inventor 郝敏
Owner 苏州市新诚氏通讯电子股份有限公司