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SMT (Surface Mount Technology) type load sheet (120W) with impedance of 50omega using aluminum nitride ceramic substrate

A technology of aluminum nitride ceramics and aluminum nitride substrates, which is applied in the direction of waveguide devices, electrical components, circuits, etc., can solve the problems that the back conductive layer cannot completely have product contact, and the heat dissipation capacity is deteriorated, so as to achieve good matching and satisfy Effect of VSWR requirements on

Inactive Publication Date: 2012-02-22
苏州市新诚氏通讯电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, some customers have adopted the SMT placement process, so that the back guide layer of the load sheet needs to leave a gap. After the placement is completed, the back guide layer cannot be completely in contact with the product, and the heat dissipation capacity will become poor.

Method used

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  • SMT (Surface Mount Technology) type load sheet (120W) with impedance of 50omega using aluminum nitride ceramic substrate
  • SMT (Surface Mount Technology) type load sheet (120W) with impedance of 50omega using aluminum nitride ceramic substrate
  • SMT (Surface Mount Technology) type load sheet (120W) with impedance of 50omega using aluminum nitride ceramic substrate

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Embodiment Construction

[0011] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0012] Such as figure 1 As shown, the impedance is 50Ω aluminum nitride ceramic substrate 120 watts SMD type loading chip includes a 6*9*1mm aluminum nitride substrate 1, the back of the aluminum nitride substrate 1 is printed with a separate back-conducting layer 6, nitrogen The front side of the aluminum substrate 1 is printed with a resistor 3 and a wire 2. The wire 2 is connected to the resistor 3 to form a load circuit. The back conducting layer and wire 2 are printed with conductive silver paste, and the resistor 3 is printed with resistive paste. A glass protective film 4 is printed on the resistor 3 . A layer of black protective film 5 is also printed on the upper surfaces of the wires 2 and the glass protective film 4 .

[0013] The impedance of this structure is 50Ω aluminum nitride ceramic substrate 120 watts patch type load chi...

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Abstract

The invention discloses an SMT (Surface Mount Technology) type load sheet (120W) with impedance of 50omega using an aluminum nitride ceramic substrate. The SMT type load sheet comprises the aluminum nitride substrate with the size of 6*9*1mm, wherein, a rear conductor layer is printed on the rear face of the aluminum nitride substrate; and resistors and leads are printed on the front face of the aluminum nitride substrate and are connected together to form a load circuit, a grounding terminal of the load circuit is electrically connected with the rear conductor layer, and glass protective films are printed on the resistors. The SMT type load sheet (120W) with the impedance of 50omega using the aluminum nitride ceramic substrate has the advantages that stable performance can be ensured on a high-frequency end, thus meeting the market requirements; and in addition, the SMT type design with high power up to 120W is realized on the aluminum nitride ceramic substrate with the size of 6*9*1mm so as to complete a product catalog of the SMT type high-power aluminum nitride ceramic load sheet and promote the conversion process of the manufacture procedure from an MI type aluminum nitride ceramic load sheet to the SMT type aluminum nitride ceramic load sheet in the industry.

Description

technical field [0001] The present invention relates to an aluminum nitride ceramic substrate load chip, in particular to a 120-watt patch-type load chip with an impedance of 50Ω aluminum nitride ceramic substrate, which extends the product series of SMT-type aluminum nitride power load chip and completes its The design process of SMT type patch load chip is gradually from low power to high power. Background technique [0002] High-power aluminum nitride ceramic substrate load sheets are different from traditional resistors. Due to the requirements for high power, the general size is relatively large. The manufacturing process is similar to MI manual welding. Due to the human factors in the process , leading to the increase of unreliable factors in the production process, thus making the stability of product quality worse. Moreover, the way of manual work is easy to make the enterprise subject to the limitation of human resources. Therefore, in recent years, manufacturers ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/22
Inventor 郝敏
Owner 苏州市新诚氏通讯电子股份有限公司
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