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Anti-electromagnetic interference chip encapsulating method

An anti-electromagnetic interference and chip packaging technology, applied in the manufacturing of circuits, electrical components, semiconductor/solid-state devices, etc., can solve problems such as disturbing the operating frequency, reducing the working stability of electrical equipment, and the chip being susceptible to electromagnetic radiation. Reasonable arrangement of procedures, efficient operation and convenient implementation

Inactive Publication Date: 2012-02-29
常熟市广大电器有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These high-performance chips are easily affected by electromagnetic radiation during operation, which disturbs their operating frequency and reduces the working stability of electrical equipment.

Method used

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Embodiment Construction

[0017] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0018] figure 1 It is a process step chart of the chip packaging method for anti-electromagnetic interference in the embodiment of the present invention; the packaging method includes the following steps: a) fixing the chip, b) fixing the substrate, c) pre-testing, d) coating the conductive layer, e) sealing the glue Encapsulation, f) curing and shaping, g) post-test, h) attaching the metal outer film.

[0019] The specific implementation steps are as follows:

[0020] a) Fix the chip. The chip adopts flip-chip technology to realize the electrical connection with the substrate. Among them, the tin block is used as the physical contact point betw...

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Abstract

The invention discloses an anti-electromagnetic interference chip encapsulating method, which comprises the following steps of: (a) fixing a chip; (b) fixing a substrate; (c) pre-testing; (d) coating a conductive layer; (e) encapsulating with a sealing compound; (f) curing and sizing; (g) after-testing; and (h) attaching an outer metal film. The anti-electromagnetic interference chip encapsulating method disclosed by the invention has reasonable procedure arrangement; a chip encapsulating body manufactured with the method has dual anti-electromagnetic interference capabilities, electromagnetic radiation can be effectively grounded for leading out, and efficient running of the chip is ensured; and meanwhile, a chip encapsulating process has low cost, is convenient to implement, and is suitable for batch production.

Description

technical field [0001] The invention relates to a chip packaging method, in particular to a novel chip packaging method capable of blocking electromagnetic interference, and belongs to the technical field of chip packaging. Background technique [0002] In the manufacture of integrated circuits, chips are obtained through the steps of wafer fabrication, forming integrated circuits, and cutting wafers. After the integrated circuit of the wafer is fabricated, the chip formed by dicing the wafer can be electrically connected to the carrier outwardly; wherein, the carrier can be a lead frame or a substrate, and the chip can be wire bonded or covered. The method of crystal bonding is electrically connected to the carrier. If the chip and the carrier are electrically connected by wire bonding, then enter into the manufacturing step of filling the encapsulant to form the chip package. Chip packaging technology is a process technology that wraps the chip to avoid contact between t...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/56H01L21/60
Inventor 徐子旸
Owner 常熟市广大电器有限公司
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